Equipment Optimization
Session Co-Chairs: Fred Bouchard, Paul Werbaneth
Advanced manufacturing requires timely information, robust parts and a solid understanding of the interplay between components and process. This session will focus on new ways to calibrate epi chambers, coatings to protect chamber components and prevent flaking, impact of plating nozzles on copper voiding, and modeling of elastomer aging in sealing applications.
Tuesday, May 14, 2024
1:50 PM ET
6.1 UPC Fault Reduction via CPEC Backside Surface Roughness Control
Z. V. Ooi, C. W. A. Tan, C. T. Lim, M. Peng, C. Koh, GlobalFoundries
6.2 Combining Batchspray and Ozone Reduces Chemical Consumption in Wafer Cleaning
B. Hammerl, Siconnex Customized Solutions
6.3 Die-Level Serialization Platform Demonstration
M. Delafosse, R. Beaudry, C. Canu, Digitho Technologies
6.4 Reduction of Stiction Using Different Surface Treatment Methods on Elastomers and Their Longevity Studies
M. Khosrawi, T. Dunn, R. Brielmann, F. Durn, M. Gulcur, Trelleborg Sealing Solution