Session 3—Advanced Equipment Processes and Materials 1: Metals & BEOL Materials
Session Chairs: Susan Fan, IBM, Lenny Rubin, Axcelis, Thirumalesh Bannuru, Wolfspeed
Processes for advanced metalization and inter-metal dieelectrics. Defect density reduction in BEOL processing.
Tuesday, May 14, 2024
11:05 AM ET
3.1 Wet Etch Recipe Optimization for Enabling RMG Multi Vt Scheme
A. V. Ramirez, M. Sankarapandian, R. Bao, W. Parkin, IBM Research; T. Makoto, K. Takuya, SCREEN Semiconductor Solutions
3.2 Evaluation of Different Metal Preclean Conditions for MOL for 2NM and Beyond
S. Munnangi, A. Simon, M. Shoudy, O. Van Der Straten, R. Krishnan, S. Siddiqui, IBM Research
3.3 Optimization of Area Selective Barrier on Different Metal Interconnects
L. Wangoh, A. Simon, M. Shoudy, IBM Research
3.4 BEOL Dielectric Film Delamination Reliability Improvement by Eliminating Silicon-Rich Interface
A. Dineshan, C. Jane, GlobalFoundries