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Session 20

Advanced Metrology 3

Session Chairs: Padraig Timoney, Delphine Le Cunff

Thursday, May 16, 2024

9:10AM ET 
20.1 Scatterometry Critical Dimension Solution for Gate All around Sheet-Specific Metrology
H. Chouaib, KLA Corporation


20.2 Advanced Metrology of Thick Silicon Nitride Films at 300 MM Scale for Next Generation High-Q Photonic Devices
S. Kar, K. Morgan, L. Carpenter, N. Fahrenkopf, C. Baiocco, American Institute for Manufacturing Integrated Photonics (AIM Photonics); N. Gangi, Rensselaer Polytechnic Institute 

 

20.3 Thickness Description of Thick GaN Film Stack and Measurement of Al Percentage in AlGaN Alloy with the KLA SpectraShapeTM 10K
G. Baldi, F. De Paola, KLA Corporation; A. Severino, I. Mongiatti, STMicroelectronics

 

20.4 Optimization of Scatterometry Measurements by Enhancing with Machine Learning
S. Srichandan, F. Heider, G. Ehrentraut, S. Lilje, C. Putzi, S. Radosavljevic, Infi neon Technologies; E. Sakalauskas, Nova Measuring Instrument

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