Advanced Metrology
Session Co-Chairs: Jay Mody, Samira Bagheri, Cody Murray
This session contains presentations from a variety of techniques, applied in novel ways to provide important information for process and quality improvements. These techniques include overlay measurements, CD-SEM and scatterometry. Artificial intelligence, machine learning and deep learning are employed to improve the quality of measurements.
Tuesday, May 14, 2024
9:30 AM ET
2.1 Coming of Age in Computational SEM
Y. Ball, S. Klotzkin, B. Bunday, D. Patriarche, AMAG nanometro
2.2 Metal Etch Depth Metrology Using YieldStar and CDSEM
R. Anunciado, I. Aliaj, R. van Haren, ASML; V. Truff ert, A. Moussa, D. Goossens, A.Tamaddon, IMEC
2.3 Micro- and Macro-Domain Analysis of Whole Silicon Carbide Wafers by T-Ray Imaging
A. Rahman, Applied Research and Photonics
2.4 3D Shape Measurements of Patterned Silicon Wafers
J. Gaudestad, J. Trujillo-Sevilla, J. M. Ramos-Rodríguez, K. Ivanov Kurtev, G. Castro Luis, M. Jiménez-Gomis, Wooptix; J. Gaudestad, K. Ivanov Kurtev, M. Jiménez-Gomis, Industrial
Engineering Department Universidad de La Laguna