Advanced Equipment Processes and Materials 3: Tool and Process Optimizations
Session Chairs: Olaf Storbeck, Katie Lutker-Lee
Thursday, May 16, 2024
9:10AM ET
19.1 Study of Wafer Arcing Defects on PECVD Low Deposition Rate TEOS Oxide Thin Film
M. Wang, I. Low, YB Lee, J. Schmitt, GlobalFoundries
19.2 TEOS Integrated High-Low Pressure RPS Clean
H. K. Tan, M. K. C Yuang, C. C. Chiam, K. Chuah, X. Jun, L. K. Peng, GlobalFoundries Singapore
19.3 Process Margin Improvement and Cost Saving from a New Plasma Oxide Etch Process with Endpoint Algorithm During Photolithography Positive-to Negative-Tone Develop Conversion
J. Ye, T. Smith, A. Fritz, K. Sarkar, A. Fang, Micron Technology; A. Liew, Micron Semiconductor
19.4 Protocol Implementation for Thermal Donors Monitoring on High Resistivity Silicon Wafers
A. Abbadie, A. Desse, K. Melhem, S. Mariani, D. Fagiani, P. Zuliani, STMicroelectronics