Advanced Process Control 2
Session Co-Chairs: Agnès Roussy, Zhixing Li
This session discusses process control schemes utilizing advanced data analytics, computational algorithms and statistical methods to improve wafer process steps, yield and cost.
Wednesday, May 15, 2024
3:25PM ET
15.1 Dynamic Time Warping Constraints for Semiconductor Processing
R. Owens, F. Sun, D. Boning, Massachusetts Institute of Technology; C. Venditti, D. Blake, J. Dillon, Analog Devices
15.2 Optimizing High-Product-Mix Manufacturing with Advanced Process Control Through Machine Learning-Based Virtual Metrology
H. J. Lee, S. Jayaram, S. Choi, N. Greeneltch, Siemens EDA
15.3 Using Bert Pre-Trained Image Transformers to Identify Potential Parametric Wafer Map Defects
E. Jen, Y. Ting, CH Jan, L. Huang, C. Lin, M. Wu, A. Feng, C. Wen, H. W. Chen, J. Yeh, C. Lai, B. Chen, MediaTek
15.4 Unsupervised Trace-SPC Anomaly Detection Solution Based on VAE Model
X. Wang, H. Jiang, Semitronix Corporation