Advanced Equipment Processes and Materials 2: Advanced Structures
Session Co-Chairs: Henan Zhang, Leonard Rubin
Advanced Structures, GAA and Vertical Transistors
Wednesday, May 15, 2024
1:30PM ET
13.1 Withdrawn
13.2 Development of Epitaxial SiGeb as a Test Vehicle to Evaluate Source-Drain Etchout During Channel Release of Gate-All-Around Devices
M. Nasseri, IBM Research
13.3 SCCO2 Drying for Preventing Pattern Collapse in Advanced Logic Device Structures
M. Sankarapandian, W. Lo, A. V. Ramirez, N. Flores, X. Liu, IBM Research; R. Yamanaka, S. Inoue, S. Shimomura, K. Iwanaga, Tokyo Electron
13.4 Lithography WEE, EBR and Pre-SiGe HF Clean Flow Rate Optimization for Wafer Edge Defectivity Improvement
J. Chow, D. Adukkadukkam, S. E. Choon, D. Ong, S. T. Kiat, GlobalFoundries