Advanced Metrology 2
Session Co-Chairs: Chris Long, Alok Vaid, Siddarth Sampath
This session contains presentations discussing new and innovative metrology techniques for analysis of chemicals and wafer surfaces used in the semiconductor manufacturing process. These techniques include aerosol-based particle sizing, time-of-flight mass spectrometry (TOF-MS), plasma focused ion beam (PFIB) and scanning electron microscopy (SEM).
Wednesday, May 15, 2024
10:55AM ET
12.1 First Results from a New Online Nano Liquid Particle Monitor on Ultra-Pure Water
K. Farmer, H. Han, N. Birkeland, TSI Incorporated
12.2 Innovative Approaches for 3D Metrology and Defect Analysis on Advanced Packaging Structures
I. Wu, M. Mullen, M. McClendon, P. Carleson, X. Gu, M. Wu, Thermo Fisher Scientific
12.3 New High-Resolution Method to Characterize CMP Slurry Particle Size Distributions
A. Tiwari, A. Patel, D. Troolin, J. Koczak, N. Birkeland, H. Han, TSI Incorporated
12.4 Rapid Analysis of Trace Organic Contaminants in Semiconductor Grade Chemicals
S. Ketkar, B. Dufek, T. Herek, C. D. Quarles, A. Schultz, D. Wiederin, Elemental Scientific