Poster Session
Session Chairs: David Tucker, Raymond Van Roijen, Thanas Budri
Tuesday, May 14, 2024
| An Innovative Method and Apparatus for KGD Testing of 2.5D & 3D Stacked Dies, with Emphasis on High Bandwidth Memory (HBM) | Calvin Park, AMT |
| Novel Chemical Development for Post Metal Etch Clean | Lynn Covolo, Yve Han, Sushil Patil, Zahir Alamgir, Devin Freeman, Nicholas Jira, Luke Kiehl, Sanjna Lakshminarayanamurthy, Vincent Sih, Satish Singh, Nirmal Sundaramoorthy, GlobalFoundries; Hisashi Shinomura, Yoshiyuki Kajiki, Hiroyuki Tano, Koji Kawahara, Satoshi Kamo, JSR |
| Reliable Cu Reliable CU Pillar Undercut Control Using the Endpoint Detection System | Zachary Gardner, Soon-cheon Seo, Sankar Sankarapandian, Pijeng Khor, Chris Waskiewicz, Eric Perfecto, James Demarest, Karthik Pillai, IBM Research |
| Highly Selective Si vs. SiGe and SiGe vs. Ge Wet Etch for Sub 2nm Applications | Chien-Pin Sherman Hsu, Avantor |
| Rapid Thermal Annealing for Shallow Junction and Its Impact on FinFET Integration | Hyung Yoon Choi, Jonathan McCutcheon, Shiqi Yin, Solomon Arputharaj Thanapaul Sugantharaj, Hyunjun Sim, Bas Korevaar, GlobalFoundries FAB8 |
| Hafnium Chloride Pulse Time Reduction on Atomic Layer Deposited High-K HfO2 Dielectric Films | Meena Rajachidambaram, Bridgette Rodman, Alyssa Bennett, Justin Clements, Bas Korevaar, Globalfoundries |
| The Constraint Artificial-Intelligence Assisted Method for Etching Structure Optimization | Zusing Yang, Ying-Hung Liang, Cheng-En Tsai, Ming-Tsung Wu, Yuan-Chieh Chiu, Hong-Ji Lee, Nan-Tzu Lian, Tahone Yang, Kuang-Chao Chen, Chih-Yuan Lu, Macronix International |
| Rapid Analysis of Trace Organic Contaminants in Semiconductor Grade Chemicals | Suhas Ketkar, Brianna Dufek, Tyler Herek, C Derrick Quarles, Austin Schultz, Daniel Wiederin, Elemental Scientific |
| The Value of In-Line Metrology for Advanced Process Control | Jaeho Lee, Mike Young-Han Kim, Yongsoon Eun, DGIST |
| Water Vapor Measurements of Ultra-Pure Gases for Critical Manufacturing Processes | Hannu Sairanen, Vaisala Oyj |
| Impact of Implantation Conditions on the In-Depth Distribution of Implanted Species In SiC and GaN | Laura Creon, Jinlei Ren, Seoyoun Choi, Paula Peres, Matt Pietrucha, CAMECA; Frank Torregrosa, Stephane Morata, Ion Beam Services IBS |
| Novel Approach Utilizing APIMS Technology for Analyzing CO & H2 Impurities in Semiconductor UHP Gases | Greg Their, Process Insights |
| Die-level Serialization Platform Demonstration | Maurice Delafosse, Richard Beaudry, Cedric Canu, Digitho Technologies |
| Elimination of Pin Hole Defect in Digit Contact SADP Process by Using Plasma RF Power Pulsing | Wan-Ping Lien, Jeff Ye, Youshen Wu, Ruby Chiu, Becky Wu, Micron Memory Taiwan |
| Process and Tool Monitoring Strategy for Advanced Magnetic Tunnel Junction Stack Deposition | Gabriel Rodriguez, Oscar van der Straten, Virat Mehta, J.M. Slaughter, Christian Kaiser, Chien-Fu (Frank) Huang, Daniel Frye, Ryan Carr, IBM Research |
| Analyses of eSiGe Defects Induced by Outdoor Airborne Nanoparticles | Jongmin Lee, Jungtae Park, il-jin kim, Haeun Lee, Sehoon Park, Yonsei University |
| Optimization of O2 Plasma Treatment after Silicon Etch Process to Prevent Br-induced Equipment Corrosion and Pattern Abnormality | Junseok Kang, Ki Dong Yang, Soobin Sinn, Gyuwon Gim, Hanbit Park, Wookyoung Hwang, Eunyoung Han, Young Jeong Kim, Joong Jung Kim, Samsung Electronics |
| Controlling Discharge Condition of PE-SION Deposition Process for Finding a Balance Between NH3 Outgassing and Surface Remaining NH4+ Ions | Ki Dong Yang, Kwangtae Hwang, Youngsoo Jung, Keungjoo Suk, Joonho Lee, Youngeun Kim, Jaein Jeong, Young Jeong Kim, Joong Jung Kim, Memory Division, Samsung Electronics |
| Consideration of Ga-FIB in Lamella Sample Prep for EBIC Analysis of Advanced-Node SRAMs | Gregory Johnson, Heiko Stegmann, Cheryl Hartfield, Carl Zeiss Microscopy; Andreas Rummel, Kleindiek Nanotechnik |
| Machine Learning Based SEM Image Analysis for Automatic Detection and Classification of Wafer Defects | Sanghyun Choi, Srividya Jayaram, Qian Xie, Nathan Greeneltch, Hyung Joo Lee, Mohan Govindaraj, Mark Pereira, Sayani Biswas, Samir Bhamidipati, Ilhami Torunolglu, Siemens EDA |
| An Implementation of a Machine Learning Methodology for Improving Test Data Quality | Heng Wah Ho, GlobalFoundries; Pojcharapol Leenukiat, National University of Singapore |
| Improving Measurement Data Quality with Machine Learning | Jun Hao Tan, Heng Wah Ho, GlobalFoundries |
| Big Data Analytics for Real Time Dispatch | Himanshu Mogra, James Delong, Remy Canales-Vaschy, Srikanth Ramakrishnan, Sriram Sridharan, Srikanth Penumutchu, GlobalFoundries |
| Real Time Water Leak Detection and Preventing Yield Excursions in Lithography | Shine Arkar Aung, Sani Fazuli, Liu Houdong, Photolithography Module, Globalfoundries GIGA+ |
| Design Modification to Mitigate Ethylene Glycol Corrosion Risk in Dry Etching Machine | Rendy Wiyogo Gozali, Loh Kim Shiang, Thiruchelvam Rajkumar, Joselito Butiu, GlobalFoundries Singapore |
| Wafer Edge RF LNR Yield Improvement in Oxide Etch Applications | Fook Yen Chai, ChiHo Lee, Bo Li, KinWai Tang, GlobalFoundries |
| Streamlining Critical Queue Timer Management: A Digital Twin Approach to Optimize Frontend Manufacturing | Hajo Terbrack, Holger Brandl, Philipp Rossbach, SYSTEMA |
| Real-time Balancing of WIP for Compatible Capacities across distant Fab Buildings using Automated Cross-Location Decisions | Binay Dash, Detlef Pabst, Edmund Tan, Jonathan Lee, Alex Wong, ViswaDevan Nair Ramadhasan, GlobalFoundries |
| Auto Furnace Scheduler with Built in Timelink Regulator | Tin Zar Tun, Kok Tee Lim, GlobalFoundries Singapore |
| Using Monte Carlo Simulation - a Predictive Model to Identify Capacity and Cycle Time Detractors in a Semiconductor Foundry | Vikram Arjunwadkar, Boyd Finlay, Sofia Khudyakov, GlobalFoundries |
| Simulations of Elastomeric Seals in Temperature Cycling to Predict Service Time | Chien Nguyen, Greene, Tweed & Company |
| The Digital Twin Difference - a Blueprint for the Semiconductor Manufacturing Metaverse | Urmi Sen, David Gross, Siemens Digital Industries Software |
| Strategies to Attract the Next Generation of Talent to the Semiconductor Industry | Marie Le Guilly, Entegris; Justine Feist, ESS; Faith Isowamwen, Clarkson University |
| Investigation of Power Down Leakage Bin Fallout Caused by Fixed Location Gate Oxide Pin Hole | Jia Liang Tang, Mohd Nurul Islam, Kiat Sean Tan, GlobalFoundries |
| Solution for Pond Shape Defect Near Wafer Edge | Mei Yen Koe, Juncheng Zhou, Vinod Xavier, GlobalFoundries |
| Periphery Gate Optimization for reducing Single-Sense Amp (SSA) failure in DRAM | Ketaki Sarkar, Rizwan Tariq, Bryan Orf, William Simpson, Todd Smith, Aayush Mittal, David MacMahon, John Lee, Michael Hurt, Micron Technology |
| Understanding DRAM Array Contact Missing: Mechanisms study with Practical Solutions | Marvin Tsai, Ketaki Sarkar, Gus Gus, Jacob Manning, Stephen Casey, Gautham Swaminathan, Michael Hurt, Micron Technology |
| Metal Mask Rework Optimization for Metal with TaN Precision Resistor On It | Jia Liang Tang, Mohd Nurul Islam, Moh Moh, GlobalFoundries |
| Wafer Substrate Bevel Significance to Edge Yield Performance | Shuli Ma, Belinda Ng, Min Hoe Teo, GlobalFoundries |
| MTP Data Retention Improvement by Salicide Clean Optimization | Si Yien Low, Gong Cheng, Mohd Nurul Islam, Chin San Lee, Xiqiang Li, GlobalFoundries |
| Elimination of Passivation RIE Arcing in RFSOI Process | Shu Teik Ong, Wai San Loh, Yonghai Li, Shi Rui Teng, Ghit Guan Goh, Chandrasekar Venkataramani, GlobalFoundries Singapore |
| Wafer Edge Unsalicided Poly Resistor Matching Optimization with Spike Anneal Temperature Control | Belinda Ng, Eunice Tok, Ker Peng Lau, Xiaobin Wu, Globalfoundries Singapore |