Component Technology Pte Ltd started business as a distributor of production equipment to the Semiconductor

Backend Industry in 1989. We later developed our own product - automatic post wire bond inspection machines and have since become a leading solution provider in this field.

We built the world’s first 3D wire bond inspection machine that performed effectively for our customers’ quest to achieve zero defect. Through continuous development, we added features to meet the automation requirement of the industry. With over a decade of research and development, we are a reliable provider of automated and cost-effective inspection solutions. We are able to provide full support to our customers because our product is fully developed and assembled by our internal teams. 

Our products currently include automatic vision inspection machines for Wafer, Lead frame, Die / Wire Bond and X-ray Image Analyser.