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Electronics innovation touches nearly every facet of our lives. We drive hybrid and electric vehicles with advanced driver assistance systems, use smartphones to manage our work and play, see a new world through augmented reality (AR) headsets, enjoy personalized on-screen entertainment while flying in airplanes, and control our living space through connected home devices. Years ago, some of these innovations were only a dream. 

At Henkel, we're proud to create products that enable these advances.

Henkel Factory

Headquartered in Düsseldorf, Germany and founded in 1876, Henkel is the premier materials supplier for the electronics assembly and semiconductor packaging industries. Our advanced formulations include a range of products that facilitate electrical interconnect, provide structural integrity, offer critical protection, and transfer heat for reliable performance.

 

 

 

 

 

Henkel in Singapore and Malaysia

Henkel Singapore was established in 1983 and soon after, Henkel Malaysia in 1989. The company’s Singapore facilities include the Adhesive Technical Center at Haw Par Technocentre and its Global Supply Chain Hub in the and PSA Building. Henkel Asia-Pacific serves 13 markets. Its 9,000 employees represent 45 nationalities and come from a wide range of cultural backgrounds.

Henkel Adhesives Solutions for Semiconductor Packaging and Electronics

Our material portfolio includes die attach, underfills, and EMI shielding formulations for MEMS, LEDs, RF and power devices, CMOS, and image sensors. Due to the breadth of our materials portfolio, the depth of our application expertise, and the unmatched scope of our global capabilities, the world’s top technology companies – electronics innovators – partner with us.

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From die attach adhesives to liquid and film encapsulants, conductive coatings for EMI shieldings, first level underfills such as liquid and film, to thermal interface materials and conductive and non-conductive adhesives for sensors and modules, our customers can be certain their needs will not only be met, but covered by the most cutting-edge and reliable technologies on the market.

 

 

 

 

 

 

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The need to improve device performance, while complying with package miniaturization demands, is driving flip chip development. Henkel provides a variety of high-performance, JEDEC-compliant, lead-free underfill technologies for today’s most challenging flip chip designs. Henkel’s underfill systems have been specifically designed to meet the demands – primarily lowering stress, controlling warpage and increasing reliability – of thinner, modern semiconductor flip chip devices. Henkel offers a broad product portfolio of die attach, as well as liquid and film encapsulants for flip chip devices including for CSP, BGA and PoP. These include capillary underfill (CFU), non-conductive paste (NCP), non-conductive film (NCF) and warpage improvement adhesives (WIA).

 

 

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Package-level underfill systems are facilitating advances in flip-chip technology, enabling outstanding protection for these delicate devices. All Henkel package-level underfills meet JEDEC testing requirements and the demands of lead-free processing. Further protection is provided with Henkel's semiconductor encapsulants, which work together as dam-and-fill materials for bare chip encapsulation. Our high-purity liquid epoxy encapsulants offer protection from mechanical damage and corrosion during the assembly process.

 

 

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Henkel recognizes the importance of this essential memory system in computers and workstations, and provides an array of products than improve the consistency and reliability of the DRAM assembly process including printable paste die attach adhesives that offer reliable bonding with low moisture uptake and bleed, some of which require no curing.

 

 

 

 

 

 

Partnering with Henkel Singapore

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Partnering with Henkel provides access to the company’s deep technical knowhow, broad global support network, and state-of-the-art R&D capabilities. Henkel’s comprehensive product portfolio is unmatched in the semiconductor packaging and electronics assembly markets. Henkel offers materials that make advanced devices possible by facilitating strong bonds, robust electrical connections, durable device protection and reliability-enhancing thermal control.

 

 

 

 

 

 

 

Contact Person

[email protected]

Marketing Manager, Singapore & Malaysia

 

About Henkel

Henkel operates globally with a well-balanced and diversified portfolio. The company holds leading positions with its three business units in both industrial and consumer businesses thanks to strong brands, innovations and technologies. Henkel Adhesive Technologies is the global leader in the adhesives market – across all industry segments worldwide. In its Laundry & Home Care and Beauty Care businesses, Henkel holds leading positions in many markets and categories around the world. Founded in 1876, Henkel looks back on more than 140 years of success. In 2019, Henkel reported sales of more than 20 billion euros and adjusted operating profit of more than 3.2 billion euros. Henkel employs more than 52,000 people globally – a passionate and highly diverse team, united by a strong company culture, a common purpose to create sustainable value, and shared values. As a recognized leader in sustainability, Henkel holds top positions in many international indices and rankings. Henkel’s preferred shares are listed in the German stock index DAX. For more information, please visit www.henkel.com or www.henkel-adhesives.com.