OVERVIEW
- Date: September 5(Tue), 2023
- Time: 09:00 – 17:30
- Venue: Hall 3, Suwon Convention Center
- Language: Korean / English (Simultaneous interpretation will be provided)
- Organizer: SEMI
SPONSORS
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AGENDA
Session 1: High-Performance Computing
- Hetero Integration, High Performance Computing and AI - Xin Wu, Corporate Vice President, Silicon Technology | AMD
- PKG Interconnection Technology for HBM - Ki Ill Moon, VP, Head of PKG Tech. Development | SK hynix (It will not be shared)
- The next wave of Semiconductor Innovation – Multi-die system solution - Donghan Kim, Sr Staff / Head of SCSD | Synopsys
- Status of High-End Performance Packaging (2.5D & 3D) - Technology and Market Trends - Stefan Chitoraga, Technology and Market Analyst, Packaging and Assembly | Yole Group
Session 2: Interconnection Technology for HPC
- Advanced Heterogeneous Integration - Jongsoo Choi, Principal Professional | Samsung Electronics (It will not be shared)
- Interconnect via scaling and challenges with hybrid bonding - Vikas Dubey, Senior Scientist Systems Packaging | Fraunhofer ENAS
- Novel Materials for Advanced Packaging - Dongshun Bai, Senior Technologist & Business Development Director | Brewer Science
- Laser Assisted Bond (LAB) Technology Overview - SeokHo Na, Master, Sr. Director, R&D | Amkor Technology Korea (It will not be shared)