The SEMI Award for North America was established in 1979 to recognize enabling technical contributions by individuals and teams to the microelectronics industry.
For more information about the SEMI Award for North America, please Click here.
| Year | Recipient | Contribution | Area |
| 2025 | Lam Research | For the development and high-volume production implementation of cryogenic etch technology, enabling the use of novel chemistries to advance high aspect ratio etching in stacked memory manufacturing. | Process and Technology Integration |
| 2023 | Cerebras | Successful implementation of wafer-scale-integration coupled with advanced packaging and system design for Artificial Intelligence (AI) and other Deep-Learning applications as standalone units and in clusters for large-scale data centers. | Process and Technology Integration |
| 2021 | Everspin Technologies | Development and first Commercialization of STT-MRAM Memory | Process and Technology Integration |
| 2020 | ASML | Commercialization of Extreme Ultra Violet Lithography (EUV) Commercialization of Extreme Ultra Violet Lithography (EUV) | Manufacturing Process and Process Equipment |
| 2019 | Waymo (formerly the Google self-driving car project) | First Commercialization of Autonomous Vehicles for Public Roads | Automotive |
| 2018 | Philip Gadd, Intel | Developing and producing the first high volume monolithic photonic transmitting and receiving transceiver. | Process and Technology Integration |
| 2017 | Bryan Black, PhD, AMD | Integration of the "Fiji" graphics 3D-SiP | Process and Technology Integration |
| 2017 | Micron | Development of the Hybrid Memory Cube and Co-Founding the Hybrid Memory Cube Consortium | Process and Technology Integration |
| 2015 | Prof. Chenming Hu, Ph.D. | Development of the BSIM Families of Compact Transistor Model | Process and Technology Integration |
| 2015 | Alex Lidow, PhD | Commercialization of GaN Power Devices | Process and Technology Integration |
| 2014 | Terry Brewer, Ph.D., President, Brewer Science | Invention and commercialization of anti-reflective coatings used in optical lithography Dr. Terry Brewer invented an anti-reflective coating that was effective in eliminating reflective interference and provided good adhesion to multiple materials and resist. At the time, anti-reflective coating were a radical approach. Brewer Science, Inc., founded in 1981, developed and commercialized anti-reflective coating materials instrumental in the industry’s progress from g-line to 248nm to 193nm lithography, and now to extreme ultraviolet (EUV) and directed self-assembly (DSA) technology. | Lithography |
| 2014 | Jason C.S. Chang Chief Executive Officer and Chairman of the Board | Commercialization of copper wire bonds In the 1980s the semiconductor industry began exploring less costly alternatives for wire bonding. In 2006, Jason Chang and Tien Wu | Assembly and Packaging |
| 2013 | Dr. Mark Law, University of Florida Dr. Kevin Jones,University of Florida | Developed a cornerstone of the modern era of computational modeling of CMOS fabrication process with the Florida Object-Oriented Process Simulator (FLOOPS) which was introduced in 1990. FLOOPS has developed into a widely used, flexible code for multi-dimensional modeling for advanced IC fabrication processes. | Process and Technology Integration |
| 2013 | Grigor Gasparyan, Xilinx Liam Madden, Xilinx Dr. Steve Trimberger, Xilinx Suresh Ramalingam, Xilinx Steve Young, Xilinx Trevor Bauer, Xilinx Kumar Nagarajan, Xilinx (now with Maxim Integrated) | Commercialization of the silicon interposer which provides more than two orders of magnitude increase in die-to-die bandwidth per watt. This achievement effectively addressed both challenges of decreasing power and increasing bandwidth for advanced digital ICs. It also decreased latency to only 20 percent for standard input/output connections. | Assembly and Packaging |
| 2012 | Mark Bohr, Intel Robert Chau, Intel Suman Datta, Pennsylvania State University (formerly with Intel) Mark Doczy, Intel Brian Doyle, Intel Tahir Ghani, Intel Jack Kavalieros, Intel Matthew Metz, Intel Kaizad Mistry, Intel | The Intel team was honored for their contribution to the first development, integration and introduction of a successful high-k dielectric and metal electrode gate stack for CMOS IC production, first implemented at the 45nm node in 2007 | Process and Technology Integration |
| 2011 | Moungi Bawendi, MIT professor, QD Vision Science Advisory Board Vladimir Bulovic, MIT professor, QD Vision Science Advisory Board, QD Vision founder Seth Coe-Sullivan, QD Vision founder and CTO John Ritter, QD Vision, EVP of Product Development and Operations Jonathan S. Steckel, QD Vision founder and director of Chemistry | Commercialization of Quantum Dot (QD) technology | Materials and Process Integration |
| 2010 | Thomas DiStefano, Founder, Tessera John Smith, former CEO, Tessera Michael Warner, former VP Engineering & Product Development, Tessera | Commercialization of the uBGA Technology | Advanced Packaging |
| 2009 | Robert Patti | Pioneer work in the emerging technical area of 3D IC integration | Assembly and Packaging |
| 2009 | Andrew Hawryluk James McWhirter Michael Thompson Yun Wang | Annealing using grazing-angle IR laser beams | Wafer Fabrication |
| 2008 | Yoshio Nishi | Memory Development and Visionary R&D Management | Lifetime Achievement |
| 2008 | Chris Auth Mark Bohr Robert Chau Tahir Ghani Kaizad Mistry Anand Murthy Scott Thompson | Process Integration of Strain-enhanced Mobility Techniques for CMOS Transistors | Process Integration |
| 2007 | Bernard S. Meyerson | SiGe for Wireless Application | Lifetime Achievement |
| 2007 | C. Grant Willson | Chemically Amplified Resist | Lithography |
| 2006 | Igor Khandros | Wafer Test | Test Equipment |
| 2005 | Jim Koford | Integrated Circuit Design and Test Automation | Lifetime Achievement |
| Bob Shillman Bill Silver Marilyn Matz | Machine Vision Systems | Enabling Equipment | |
| 2004 | Lee Galbraith George Kren | Particle Detection System | Metrology |
| 2003 | Arthur Evans | Blade Type Fixed-Point Probe Card | Test Equipment |
| Chris Mack | Lithography Modeling | Lithography | |
| 2002 | Richard Spanier | Metrology | Lifetime Achievement |
| Tom Hedges Tom Schaefer Carl Smith Roger Sturgeon Mark Zimmer | Device Design-to-Manufacturing Data Transcription and Data Preparation Software | Design Database | |
| Glenn Tom, Ph.D. Karl Olander, Ph.D. | Safe Delivery System (SDS) Gas Storage and Delivery | Materials Technology | |
| 2001 | Robert Knollenberg, Ph.D | Particle detection in semiconductor processing | Metrology |
| Paul Allen, Ph.D. Hans Buhre Neil Berglund, Ph.D. Torbjorn Sandstrom, Ph.D. Anders Thuren Paul Warkentin, Ph.D. | Team for Photo mask laser pattern generation technology | Lithography | |
| 2000 | Doug Scott John DeBolt Jonathan Golovin | Team for Manufacturing Execution Systems and Development of PROMIS & COMETS | Factory Integration |
| Anwar Chitayat | Innovator and Developer of the Brushless Linear Motor | Enabling Equipment | |
| 1999 | Anthony Bonora Mihir Parikh, Ph.D. | Creation and Development of SMIF | Equipment |
| 1998 | Bruce Deal, Ph.D. | Silicon oxidation technology | Lifetime Achievement |
| William Cote William Guthrie Michael Leach | Pioneering development of chemical mechanical planarization processing | Process Technology | |
| 1997 | Peter Rose, Ph.D. | Innovator/founder; ion implantation technology | Lifetime Achievement |
| Norman Goldsmith Werner Kern | "RCA clean"; oxide CVD; BN diffusion | Process Technology | |
| 1996 | Kenneth Levy | Leadership in inspection, instrumentation and metrology | Lifetime Achievement |
| Robert Akins Ph.D. John Bruning Chris Sparkes Larry Thompson | Optical tooling and processes for deep UV lithography | Equipment | |
| Richard Brewer | Materials and process solutions for Lithography | Materials | |
1995
| Vincent Coates | Scanning electron microscope | Metrology |
| Arnon Gat | Rapid thermal processing | Process Equipment | |
| 1994 | Martin Hammond | LPCVD | Materials Technology |
| Paul Sandland | Automated wafer inspection | Metrology Equipment | |
| Dan Maydan David N.K. Wang Sasson Somekh | Precision 5000 | Lifetime Achievement | |
| 1993 | Marjorie Balazs | Yield Improvement | Process Control |
| 1992 | Griffith Resor | Wafer stepper development for IC Production | Process Equipment |
| 1991 | Robert Mazur | Automatic spreading resistance probe | Metrology |
| 1990 | Charles & Lucia Shipley | Positive photoresist | Materials Technology |
| 1989 | David Perloff | Wafer mapping | Metrology |
| Walter Runyan | Silicon crystal growth | Materials Technology | |
| 1988 | Douglas Peltzer | Oxide isolation technology | Process Technology |
| Ronald Hershel Martin Lee | One-to-one wafer stepper | Process Equipment | |
| Dan Maydan David Wang Sasson Somekh | Plasma etch standard | Process Equipment | |
| 1987 | Dick Blair Charles Drexel Dan LeMay | Mass flow controller | Process Equipment |
| Mord Wiesler | Die bonding | Assembly Equipment | |
| Tech Tan Warren Tice | Intrinsic gettering | Materials Technology | |
| 1986 | Roger Bastide Peter Rose Andrew Wittkower | Ion implantation systems | Process Equipment |
| C. Arthur Lasch | Automatic wafer prober | Tech. Equipment | |
| Robert Walsh | Chemical-mechanical wafer polishing | Materials Technology | |
| 1985 | Guenter Schwuttke | X-ray topography system | Metrology |
| Jean Hoerni | Planar process | Process Technology | |
| 1985 | Albert Soffa | Manual and automatic wire bonders | Assembly Equipment |
| 1984 | David Alles Robert Collier Donald Harriott John Stafford Michael Thomson | Electron beam exposure system | Process Technology |
| Neal Stouder | Linear and high/low temperature test system | Test Equipment | |
| Gordon Teal | Silicon transistor | Device Technology | |
| 1983 | J. Walter Carlson | Silicon quality standards | Materials Technology |
| Kenneth Levy | Automated photomask inspection | Metrology | |
| T. Peter Sylvan | Test systems development | Test Equipment | |
| 1982 | Karl A. Lang | Automatic diffusion furnaces | Process Equipment |
| Lawrence Martinson | Negative photoresist | Materials Technology | |
| Lawrence Plummer | Plastic device encapsulation | Assembly Equipment | |
| 1981 | Robert Grey David Manson Wayne Sanborn | Development of silane | Material Technology |
| Burton Wheeler | Photorepeating camera | Process Equipment | |
| Test Systems Group | Sentry test equipment | Test Equipment | |
| 1980 | Alfred Barsocchi Robert Eberly Donald McKenzie Alfred Taylor | Commercial doping of gasses and mixtures | Materials Technology |
| Kazuo Maeda | Low pressure CVD | Process Equipment | |
| Matt Pennings | Ultrasonic wire bonder | Assembly Equipment | |
| Sheldon Weinig | High purity, highly characterized materials | Materials Technology | |
| 1979 | Walter C. Benzing Mike McNeilly | Epitaxial silicon deposition | Process Equipment |
| Jere D. Buckley Harold Helmstreet David Markle Abe Offner | MICRALIGN projection mask aligner | Process Equipment | |
| Frederick W. Kulicke, Jr. | Wire bonding and die attach | Assembly Equipment | |
| Robert Lorenzini | Silicon crystal growth | Materials Technology | |
| Nicolas DeWolfe | Automatic semiconductor | Assembly Equipment | |
| Henry W. Gutsche | Vapor deposition of polycrystal silicon | Materials Technology | |
| Geoffrey Ryding | Ion implantation equipment | Process Equipment |