Tuesday, July 14, 2009
10:30am-12:30pm
Test, Assembly and Packaging TechXPOT
Moscone Center, South Hall

The current economic climate combined with the increasing dominance of consumer driven markets has created enormous pressures to lower the cost of test and develop new solutions to solve tough test problems. At the same time these cost pressures rise to new heights, advanced chip features, system functionality, performance goals, and package types have demanded continued innovation and advanced solutions in test. This session will explore the latest innovations in test technologies and ideas that meet today’s need for lower costs, system solutions and new test requirements

10:30am–10:50am

Transformation in Test: Transparency Across the Global Supply Chain for Time Critical Actionable Data (View Presentation – PDF)
John Bearden, principal
John Bearden Test Consulting

10:50am–11:10am

Program Generation Architecture Framework: Linking Design and ATE for Program Generation (View Presentation – PDF)
Mani Balaraman, SOC software product manager,
Advantest America Inc.

11:10am–11:30am

Software Delivers Optimized Strategic Advantages to Global Test Operations (View Presentation – PDF)
Debbora Ahlgren, vice president, sales and marketing
OptimalTest

11:30am–11:50am

Improving Time to Yield (View Presentation – PDF)
Colin Ritchie, VP marketing, DfX solutions
Verigy

11:50am–12:10pm

Package On Package Test Challenges (View Presentation – PDF)
Nasser Barabi, president
Essai Incorporated

12:10pm–12:30pm

Decrease Validation Cost with Off-The-Shelf Tools for Test: FPGAS, Modular Instrumentation and Management Software (View Presentation – PDF)
Travis White, product manager – modular instrumentation.
National Instruments

Session Moderator

Rod Martens, director of product reliability, Formfactor, Inc.