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SEMI Packaging Market Intelligence provides insight into assembly and test operations, advanced packaging supply chains, and substrate technology developments. The portfolio supports supply chain mapping, technology tracking, competitive benchmarking, and strategic planning across the semiconductor back-end.

 

Key Packaging & Test Products

  • Worldwide assembly and test facility tracking: Worldwide Assembly & Test Facility Database 
  • Glass core substrate technology and market analysis: Glass Core Substrate Technology Report (Coming soon)

Typical Semiconductor Packaging Materials

  • Organic substrates
  • Leadframes
  • Mold Compounds
  • Underfill materials
  • Bonding wire
  • Liquid encapsulants
  • Solder balls
  • Wafer level package dielectrics
  • Thermal interface materials
  • Die attach materials

A key business issue with a consumer electronics-driven market is that semiconductor and packaging in subcontractors are experiencing severe pricing pressure from their customers. Thus, manufacturers are pushing cost reduction at a faster pace to offset erosion in semiconductor average selling prices (ASP).

For the latest info, please view the info on this page as well as some of our products we have available for this market segment.

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