Southeast Asia’s Semiconductor Pulse — February 2026February opened with a familiar tension for Southeast Asia’s semiconductor landscape: demand-side optimism driven by AI and electrification, set against a trade environment that remains fluid and politically charged.Across the region, the direction of travel is increasingly consistent. Governments and industry players are moving beyond volume manufacturing toward higher-value capabilities—chip design, advanced packaging, workforce development, and deeper cross-border collaboration.Three themes stood out this month. First, “moving up the value chain” is no longer just a slogan; Malaysia and Indonesia are now explicitly framing next steps around intellectual property (IP), chip design, and capability-building. Second, advanced packaging and OSAT (outsourced semiconductor assembly and test) continue to draw investment, with capacity and partnerships expanding from Penang to Cavite and Bangkok/Nonthaburi. Third, policy and talent—often the slowest-moving levers—are being accelerated through new incentives for Singapore and more detailed national frameworks in Vietnam, paired with international partnerships and ecosystem-building.Malaysia: From export strength to IP-led competitivenessMalaysia’s semiconductor position remains formidable. But in February, the conversation shifted from celebrating scale to confronting the next constraint: ownership of IP and the ability to capture higher margins.In an interview, Malaysia’s Economy Minister described the push to move beyond assembly, packaging and testing as an “ultimate test,” emphasizing that “the value starts with intellectual property.” He pointed to new frameworks under the 13th Malaysia Plan (RMK-13) intended to help Malaysian firms access global IP platforms so chips can be designed and developed locally, and signalled expectations that foreign firms seeking to participate will establish a local presence and build Malaysian talent capabilities.¹That policy intent is being reinforced through tangible OSAT capability-building. Chipbond Technology Corporation officially opened a new advanced manufacturing facility in Batu Kawan, Penang, with close to USD 200 million in investment. The facility is positioned to strengthen Malaysia’s advanced packaging and testing footprint—including wafer bumping and wafer-level chip-scale packaging—alongside structured training programs and university collaborations aimed at building local engineering capability.³At the same time, Malaysia’s semiconductor ecosystem is increasingly being shaped by geopolitics and trade dynamics. Reports that India and Malaysia are exploring a multi-layered arrangement to collaborate in semiconductors highlight how “semiconductor diplomacy” is becoming part of supply-chain resilience strategy.² Meanwhile, Malaysian market commentary continues to flag tariff risk and shifting trade pathways as a key uncertainty for 2026 momentum, reinforcing the need to pair industrial upgrading with external risk planning.⁴Singapore: AI incentives as a competitiveness lever for advanced manufacturingSingapore’s semiconductor story this month was less about a single mega-investment and more about enabling conditions—particularly AI adoption, productivity, and innovation capacity that supports high-value manufacturing.In Budget 2026, the Government emphasized that end-to-end AI transformation requires data readiness, system rebuilding, process redesign, and workforce retraining, and announced new measures aimed at scaling adoption.⁷ The direction is clear: competitiveness will increasingly be defined by how quickly companies translate AI into operational advantage—especially in advanced manufacturing environments.Two updates stood out for semiconductor and advanced manufacturing stakeholders. First, the Enterprise Innovation Scheme (EIS) is set to be expanded so businesses can claim 400% tax deductions/allowances on qualifying AI expenditures for Years of Assessment 2027 and 2028, capped at SGD 50,000 per year.⁹ Second, the Budget statement introduced a new “Champions of AI” program to support firms aiming for comprehensive AI-driven transformation, with support expected to include both enterprise transformation and workforce training.⁷Industry commentary has welcomed the direction of travel, while also noting that incentives alone will not deliver outcomes without strong alignment to talent, change management, and sustained innovation investment.¹⁰ The Inland Revenue Authority of Singapore’s EIS documentation also clarifies the scheme structure, indicating that policy design is moving into implementation detail.⁸Vietnam: Policy scaffolding meets global partnerships and ecosystem executionVietnam’s February semiconductor narrative was the clearest example of policy and ecosystem-building moving in parallel.Coverage of Vietnam’s Resolution 57 and related national decisions framed semiconductors as a strategic pillar tied directly to science, technology, innovation and digital transformation. The report highlighted a target to establish 10 advanced testing and packaging plants by 2030, alongside a structured national approach to capability building.¹¹Human capital was positioned as the decisive constraint—and national priority. Vietnam’s approved program aims to train at least 50,000 university-level (and above) semiconductor personnel by 2030, including 15,000 specializing in chip design and 35,000 for manufacturing/packaging/testing, alongside AI expert development and lecturer upskilling.¹¹Beyond policy, engagement continues to deepen internationally. In late February, Vietnamese officials held meetings in Washington with multiple partners—including Arizona State University, Meta, and the Semiconductor Industry Association (SIA)—within the broader context of Vietnam–US cooperation in science, technology, innovation and semiconductor development.¹³ European investor interest also remained visible, with a separate report summarizing European firms signalling interest in expanding investment in Vietnam, including semiconductors and AI.¹²A Vietnam Investment Review commentary adds a pragmatic framing: Vietnam’s near-term advantage may lie less in competing at the frontier of advanced chip design and more in selective positioning within AI and semiconductor value chains, where operational execution and manufacturing discipline matter.¹⁴Indonesia: Partnerships and deal-making signal an ambition shiftIndonesia’s semiconductor news this month was defined by ambition becoming more structured, and by partnerships being treated as an accelerator rather than a dependency.In early February, Indonesia’s Coordinating Minister for Economic Affairs publicly invited Malaysia to collaborate on developing next-generation semiconductor technology. The statement acknowledged Malaysia’s greater maturity in semiconductors while arguing that emerging chip technology markets still offer room for joint growth, outlining a phased direction spanning startup ecosystem development, industrial transformation, and chip development for computing needs.¹⁵Regional collaboration surfaced in additional reporting that highlighted cooperation narratives—positioning Malaysia’s experience as a source of knowledge transfer and supply-chain strengthening as Indonesia builds capabilities.¹⁸ A related angle came from Sarawak, (Malaysia), where leaders discussed the importance of investing in research facilities and skilled workers, and where Indonesia’s upstream raw-material advantage—particularly silica sand—was cited as part of a longer-term value chain progression toward wafers.¹⁷Then, in the second half of the month, deal-making entered the picture. Reuters reported that Indonesia and US firms signed deals valued at USD 38.4 billion, including two semiconductor joint venture agreements—one valued at USD 4.89 billion.¹⁶Philippines: OSAT expansion anchored by workforce developmentThe Philippines’ most notable February semiconductor story centred on OSAT scale-up—and how that expansion is being paired with skills development.BusinessWorld reported that ASE, a major OSAT player, is planning a 26,000-square-meter expansion in the Philippines, with the Philippine Economic Zone Authority (PEZA) describing it as a positive signal of continued investor interest in the electronics and semiconductor sector. The article also highlighted workforce development initiatives connected to ASE’s operations and the broader ecosystem.¹⁹A separate report reiterated the expansion scale and highlighted discussions with PEZA on capability transformation and potential partnerships, including deeper academe–industry linkages.²⁰Thailand: Equipment supply chain ambitions and cross-border OSAT integrationThailand’s February semiconductor story leaned into two connected ideas: becoming more attractive to upstream ecosystem players, and strengthening the resilience of backend capacity through partnerships.One report highlighted Thailand’s perceived strengths in attracting ASML’s supply chain interest, pointing to established electronics industry coverage (including assembly/testing and components such as PCBs), stable infrastructure, and reputation as a trusted production base. It also argued Thailand needs a clearer “Grand Strategy” linking semiconductors to adjacent sectors to secure long-term investment.⁶In parallel, Infineon announced it had completed the sale of its backend manufacturing site in Bangkok/Nonthaburi to Malaysia’s Malaysian Pacific Industries Berhad, while securing a long-term supply agreement. Infineon emphasized continued commitment to Thailand and referenced its ongoing backend investment footprint, including the construction of a new backend fab in Samut Prakan.⁵Regional takeaway: Southeast Asia is becoming a “networked semiconductor hub”Taken together, February’s news points to Southeast Asia behaving less like isolated national plays and more like a networked semiconductor hub—where each market is strengthening a different layer of the value chain, and cross-border partnerships are becoming the default route to speed and scale.Malaysia is explicitly aiming to translate manufacturing scale into IP and design capability, while adding OSAT depth through new advanced packaging investments. Singapore is tightening the innovation flywheel by expanding AI-related incentives that can improve advanced manufacturing productivity—an increasingly decisive factor in semiconductor competitiveness. Vietnam is building policy scaffolding and talent capacity while deepening partnerships with global stakeholders, increasingly framing execution and ecosystem-building as differentiators. Indonesia is signalling intent through both regional collaboration and large-scale international deal-making. The Philippines is reinforcing its OSAT relevance with expansion tied to workforce development. And Thailand is sharpening the narrative around being a trusted production base while connecting more actively to upstream equipment and backend partnership strategies.As the region moves into the rest of 2026, the most important question will not be whether Southeast Asia can attract semiconductor activity—momentum already suggests it can—but whether countries can sustain the “hard parts” of competitiveness: consistent policy execution, deep talent pipelines, reliable infrastructure, and the ability to embed local suppliers into global quality and reliability requirements.References¹ The Business Times, Malaysia’s 10-year chip design goal is facing ‘ultimate test’: economy minister (4 Feb 2026) ² Reuters, India, Malaysia to deepen collaboration on semiconductors (5 Feb 2026)³ MIDA, Chipbond Technology Strengthens Malaysia’s Advanced Semiconductor Ecosystem with New Penang Facility (9 Feb 2026)⁴ The Star, Malaysia’s trade momentum to sustain in 2026 (23 Feb 2026)⁵ Infineon, Infineon completes the sale of its manufacturing site in Bangkok/Nonthaburi, Thailand (4 Feb 2026)⁶ The Nation Thailand, Thailand’s 4 Strengths to Attract ASML: Grand Strategy Needed (7 Feb 2026)⁷ Singapore Budget, C. Harness AI As A Strategic Advantage (12 Feb 2026)⁸ IRAS, Enterprise Innovation Scheme (EIS) ⁹ The Straits Times, Budget 2026: Companies to receive tax deductions on AI spending, more support to employ tools (Feb 2026)¹⁰ The Business Times, Budget 2026: AI boost a shot in the arm, but funding alone won’t drive transformation, says industry (12 Feb 2026)¹¹ VietnamPlus, Resolution 57: Policies paving the way for semiconductor industry (9 Feb 2026)¹² Design Reuse, European firms eye investments in finance, semiconductors, AI in Vietnam (9 Feb 2026)¹³ Viet Nam News, Việt Nam, US enhance cooperation in sci-tech, innovation, digital transformation (21 Feb 2026)¹⁴ Vietnam Investment Review, Vietnam making the leap into AI and semiconductors (20 Feb 2026)¹⁵ ANTARA, Indonesia seeks partnership with Malaysia in semiconductor industry (3 Feb 2026)¹⁶ Reuters, Indonesia, U.S. firms sign deals worth $38.4 bln in textile, energy, tech sectors, Indonesia govt says (19 Feb 2026)¹⁷ Indonesia Business Post, Sarawak eyes semiconductor investment in Indonesia to boost digital economy collaboration (4 Feb 2026)¹⁸ Malay Mail, Indonesia courts Malaysia as partner in drive to develop future semiconductor technologies (4 Feb 2026)¹⁹ BusinessWorld, ASE eyes 26000-sqm expansion in Philippines (5 Feb 2026)²⁰ BusinessMirror, Taiwan firm to expand operations in PHL (4 Feb 2026)