SEMI Packaging Tech Seminar and ESPAT meeting 2015



Free for Members, 130€ for Non-Members

Optional: Networking Dinner and Social Program
 
Organized by SEMI Europe
Hosted by NANIUM, S.A
 

Tech Seminar Conference

- Session 1: European Packaging Showcase

In an effort to promote European industry, a selection of European companies will have the opportunity to showcase their activity in Packaging, Assembly and Test.
- Session 2: Large Format Fan-Out Packaging
Invited international equipment and material companies as well as RTOs will present their solutions and readiness status for large format Fan-Out Packaging.

Tabletop Exhibition
Throughout the day, event sponsors will have the opportunity to present their companies on Tabletops near the auditorium. Having a Tabletop will allow sponsor companies to present banners, posters and/or distribute communications materials during numerous networking breaks during the Seminar.

NANIUM, S.A. Fab Visit & Social Program
Attendees will have the possibility to visit NANIUM's fab at the end of the afternoon. The day will be concluded by a social event and networking dinner in Porto.

ESPAT Meeting
ESPAT is the Industry Interest Group (IIG) for European Semiconductor Packaging, Assembly and Test manufacturing service providers. This initiative was launched in October 2013, and its second meeting will take place at NANIUM in Vila do Conde, Portugal. Click here for more information on ESPAT and the next ESPAT meeting!

 



PROGRAM
Thursday, June 18th   
 
07:45   
 
Shuttle bus departure from recommended hotels in Porto
08:00
 

Shuttle bus departure from recommended hotels in Vila do Conde/Povoa de Varzim
  
08:15
 
Registration Opens- Networking Coffee
 
09:00
 
 
Welcome & Organizational Information
Yann Guillou & Steffen Kroehnert 
SEMI Europe, NANIUM, S.A.
 
09:10
 
 
CEO Address
Armando Tavares, President of the Executive Board
NANIUM, S.A.
 
SESSION 1: European Packaging, Assembly and Test Showcase
Chairman:  Steffen Kroehnert, Director of Technology, NANIUM S.A.

09:20
 

Session Introduction

 
09:25


 
 
Keynote Speaker:
European Market: from Innovation to Manufacturing

Rozalia Beica, CTO
Yole Developpement
 
09:45
 
 
European Showcase Pitches
STMicroelectronics - 3DPlus - Sencio - First Sensor Microelectronic Packaging (FSP) - Presto Engineering
 
10:30
 
Coffee break & Exhibition
 
11:00
 
 
European Showcase Pitches 
Amkor Technologies - ASE Group - RoodMicrotec - EV Group -  DISCO - TOWA - Assembléon - BESI
 
12:20
 
Lunch break & Exhibition
 
SESSION 2: Large Format Fan-Out Packaging
Chairman: Yann Guillou, Business Development Manager, SEMI Europe

13:30


Session Introduction
 
 
13:35



 
Keynote Speaker:
The Movement to Large Array Packaging:  Opportunities and Options

Jan Vardaman, President
TechSearch International
 
13:55


 
Compression Molding for Large Area Fan-Out Wafer/Panel Level Packaging
Tanja Braun, Deputy Group Manager Assembly and Encapsulation
Fraunhofer IZM
 
14:15

 

Status and Readiness for Large Format Fan-Out Packaging
Roger McCleary, Applications Manager of Lithography System Group
Rudolph Technologies, Inc.
 
14:35
 
Extending PVD System Capability for Large Area Format Fan Out
Chris Jones, Manager PVD Product Management
SPTS

 
14:55


 
SUSS Solutions for large format patterning – UV Litho and Excimer Laser Ablation
Kevin Yang, Director, Product Management Laser Processing
SUSS MicroTec

 
15.15
 
Coffee Break & Exhibition (exhibition will stay open until 17:45)
 
15:20

 
NANIUM, S.A. Fab Tours
Tours will be led in several groups. The number of places will be limited. 
 
17:25
 
End
 
17:30
 
Shuttle bus departure from NANIUM to Social event
  
19:00
 
Social Event and Dinner in Porto (paid option: 55€ per person)
 
22:00
 
Shuttle bus departure back to hotels
  
  
Friday, June 19th  
  
9:00-14:00












 
ESPAT Meeting
CLICK HERE
for more details and to see the agenda 

If you are planning on attending the SEMI Packaging Tech Seminar, registration for the ESPAT Meeting can be done in conjunction with registration for the “SEMI Packaging Tech Seminar”. 

If you wish to participate in the ESPAT Meeting ONLY, please register by e-mail via the co-chairs of ESPAT Core Team directly: Steffen Kroehnert (steffen.kroehnert@nanium.com) and Andy Longford (andy@pandaeurope.com)

If you are an ESPAT Industry Interest Group member and wish to showcase your abilities in a table top exhibition during the ESPAT Meeting, please also write an e-mail to the ESPAT Core Team co-chairs.

LOGISTICS

REGISTRATION


Registrations are now closed. 
  
PRICE


Packaging Tech Seminar Conference: FREE for SEMI Members, 130€ for Non-Members
Social event and Networking Dinner: 55€
 
SPONSORSHIP



 
Interested in sponsoring this event?
View our SPONSORSHIP OFFERS
Then fill out the SPONSORSHIP APPLICATION
Send the application to Jérôme Boutant: jboutant@semi.org 
 
VENUE



 
NANIUM, S.A.
Main Auditorium
Vila do Conde
Portugal 
 
ACCESS



 
 
NANIUM, S.A. is located in Vila do Conde (part of the greater Porto metropolitan area). Whether attendees plan to come by train, plane or by car, the company's facilities are easily accessible. 

Directions to NANIUM
 
HOTELS
 
Attendees will benefit from the following preferential pricing:

 HotelSingleDoubleLocation
 Crown Plaza100€115€Porto
Sheraton110€125€Porto
Santana
47€
55€
Vila do Conde
Grand Hotel da Povoa59€69€Povoa de Varzim

*All prices include complimentary breakfast and internet access

BOOK NOW!
 We encourage attendees to book before April 30, 2015. 

To Reserve
: send an e-mail with your reservation details (check-in/out dates, hotel & room choice) to Sandra.Faria@nanium.com
 
CONTACT




 
Yann Guillou
Business Development Manager
SEMI Europe
yguillou@semi.org
+33 (0)4 56 59 30 60
 
SPONSORS
 
      
       
 
MEDIA PARTNERS