European 3D Summit 2017 – Program


Program 2016

(2017 Info Coming Soon)


Want to buy the proceedings 2016?

315 € for members (excluding VAT)
410 € for non-members (ecluding VAT)

For any question, please contact

Anne-Marie Dutron, Sr. Director of Business Development




Monday, 18 January 2016
16:00 Registration / Welcome coffee 
16:45 Opening
Chair: James Quinn, CEO, Scint-X
17:00 Industry Perspective on Value Creation in the Packaging/Assembly and Semiconductor Industry
Christian Knochenhauer, Engagement Manager
Mc Kinsey
17:30Romain Fraux System Plus ConsultingComparison & highlight on the last 3D TSV technologies trends
Romain Fraux, MEMS& Advanced Packaging Project Manager
System Plus Consulting
18:00 FO-WLP:  Drivers for a Disruptive Technology
Linda Bal, Senior Analyst
TechSearch International
18:30Rosalia Beica, Yole Développement3D Packaging at the Forefront of the Semiconductor Industry
Rosalia Beica, CTO
Yole Développement
19:00 Cocktail
Tuesday, 19 January 2016
08:00 Registration
08:45 Opening
Session 2: 3D Packaging for High Performance Products
Chair: Juergen Wolf, Head of dept. WLSI, Mgmt. ASSID, Fraunhofer IZM
08:50Severine Cheramy, CEA-LETIFine pitch 3D technologies for HPC evolution
Severine Cheramy, Director of 3D Integration Development
09:15 3D and HPC systems
Laurent Cargemel, Manager Hardware Design Group
09:40Li Li , CISCO SystemsKEYNOTE:
Emerging 2.5D and 3D IC Packaging Platforms for System Integration

Li Li , Senior Distinguished Engineer
CISCO Systems
10:15 Coffee Break
Session 3: 3D Integration strategy for Imaging Products
Chair: Jean Michailos, R&D Technology program manager for 3D, STMicroelectronics
11:00Jean-Luc Jaffard, Redbelt ConseilImaging Technologies and applications - Pioneers of TSV and 3D technologies
Jean-Luc Jaffard, Consultant & Advisor
Redbelt Conseil
11:35Sitaram Arkalgud, Vice President Invensas CorporationExamining the Many Facets of 3D
Sitaram Arkalgud, Vice President
Invensas Corporation
12:10Jerome Chossat STMicroelectronics3D stack technology for smart camera
Jerome Chossat, head of department for digital architecture, embedded Software, Image
Signal Processing and Computer Vision algorithms in Imaging Division
12:35 Lunch Break
Session 4: New technologies for massive use of 3D integration
Chair: Martin Schrems, Vice President Technology R&D, ams
14:00BeyneNext technologies for further adoption of 3D System Integration Technologies
Eric Beyne, imec fellow & 3D System Integration Program Director
14:35Albert Ou , ASEWearable/ Handheld with 3D
Albert Ou , Department Manager Tech. Development
15:00Iain Rutherford, XFabTSV and TGV for More-than-Moore Applications
Iain Rutherford, Business Line Manager
15:25 Enabling 3D systems – a comprehensive approach from design to technology
Andy Heinig, Head of Advanced System Integration
Fraunhofer IIS/EAS
15:50 Coffee Break
Session 5: Key enabling Technologies
Chair: Severine Cheramy, Director of 3D Integration Development, CEA-LETI
16:30Nicolas Raynaud SETConsiderations on the design of high precision flip-chip bonder for mass production
Nicolas Raynaud
16:55Walther Grommes, 3M3M™ Wafer Support System, Temporary Bonding for 3D TSV
Walther Grommes, European Application Development Specialist
Start up Pitch:
17:20Kazuo Kondo, Osaka Prefecture UniversityLow TEC Electrodeposited Copper - No TSV pumping
Kazuo Kondo, Osaka Prefecture University
17:30Frédéric Raynal, CTO/VP Engineering, Aveniaveni enables the future of 3D TSV
Frédéric Raynal, CTO/VP Engineering, Aveni
17:40Ayad Ghannam, Founder - CEO, 3DiS TechnologiesWafer-Level 3D system integration enabled by peripheral multi-level 3D interconnects
Ayad Ghannam, Founder - CEO, 3DiS Technologies
17:50 End of Day 1
18:15 Shuttle bus
18:30 Gala Dinner -  Chateau de Sassenage
Wednesday, 20 January 2016
08:30 Opening
Session 6: FO-WLP: 3D options open some innovative product design
Chair: Thomas Uhrmann, Head of Business Development, EV Group
08:35Steffen Kroenert, NaniumHigh Density Package Integration for Wearables and IoT Applications by WLFO based WLSiP and WLPoP
Steffen Kroehnert, Director of Technology
HD-FO – Innovative Disruption
Ramakanth Alapati, Director, Packaging Strategy and Marketing
09:35Dave HinerAmkor’s Advanced Fan-out: Optimizing Modular Integration
Dave Hiner, Senior Director, Advanced 3D Interconnect
10:00David Butler, SPTSFOWLP Goes Mainstream. PVD Solutions for the Fastest Growing Packaging Format
David Butler, VP Product Management and Marketing
10:25 Coffee Break
Session 7: Manufacturing of 3D integrated products 
Chair: David Butler, VP Product Management and Marketing, SPTS
11:00Juan Rey, Mentor Graphics3D Integration and Its Impact on the Design-Manufacturing Interface
Juan Rey, Senior Engineering Director
Mentor Graphics
11:30Yens Ho, R&D VP, XintecPackage methods for realizing multi-functional chips integration by using various through silicon technologies
Yens Ho, R&D VP, Xintec
11:55H Moitzi, CTO AT&SNovel Packaging and Interconnection Technologies - Challenges and Opportunities for Printed Circuit Board of the Future
Heinz Moitzi, CTO
12:20Martin Schrems, Vice President Technology R&D, amsStatus and outlook for 3D sensor IC manufacturing
Martin Schrems, Vice President Technology R&D
12:45 Closing Remarks
13:00 Lunch Break
14:00 -16:00 Minatec Innovation Show Room Tour
 European 3D Summit Steering Committee
Hans AuerSenior Product Marketing Manager at Evatec, VPOerlikon Systems
Eric BeyneDirector of Advanced Packagingimec
David ButlerVP Product Management & MarketingSPTS
Sévérine CheramyDirector of 3D Integration DevelopmentCEA-Leti
Jean MichailosR&D Technology Program Manager for 3DSTMicroelectronics
Hugo PristauzVP Product Line TCB and Die SortingBESI
James QuinnCEOScint-X
Martin SchremsVP Process Development and Implementationams AG
Thomas UhrmannHead of Business DevelopmentEV Group
Juergen WolfHead of Dept WLSI, Mgmt. ASSIDFraunhofer IZM
Margarete ZoberbierInternational Product Manager BonderSUSS MicroTec