European 3D TSV Summit 2014 - Agenda


Monday, January 19th 
   
16:00Registration / Welcome coffee
 
16:45Opening
Heinz Kundert, President
Yann Guillou, Business Development Manager

SEMI Europe
 
MARKET BRIEFING
Chairman: Jim Quinn, CEO, Scint-X
17:00
The Future of Packaging and Test: Convergence or Coexistence ?
Barnett Silver, SVP & Principal
ATREG
 
17:30
From Development to Manufacturing: An Overview of Industry's 3D Packaging Activities
Rozalia Beica, CTO
Yole Developpement
 
18:00Gap Analysis: Focus Area for 3D IC Advancements
Jan Vardaman, President
TeachSearch International
 
18:30Cost Modeling for 2.5/3D Technologies and Supply Chain Impacts
Scott Jones, Director & Semiconductor Practice Lead
AlixPartners 
 
19:00Cocktail - Minatec
 
Tuesday, January 20th
 
08:00 Registration
 
09:00 Opening
Yann Guillou, Business Development Manager
SEMI Europe
 
THE DUALITY BETWEEN TECHNOLOGY & APPLICATION
Chairman: Margarete Zoberbier, International Product Manager Bonder, Suss Microtec
09:15 Mapping 3D Technology to 3D Applications: a 3D Landscape
Eric Beyne, Fellow and Program Director 3D System Integration
imec

 
09:40 Paving the Way to a Smarter Integration
Farhang Yazdani, CEO
Broadpak

 
10:05  2.5D & 3D Integration: Where we have been, Where we are now, Where we need to go?
Mustafa Badaroglu, Senior Program Manager
Qualcomm

 
10:30 Coffee Break
 
SMARTER SYSTEMS
Chairman: Patrick Leduc, Program Manager 3D IC, CEA-LETI  
11:15 KEYNOTE:
Die Stacking Is Happening
Bryan Black, Senior Fellow
AMD

 
11:50 
 
High Density 3D IC for Digital Systems
Fabien Clermidy, Head of Digital Design and Architecture Lab
CEA-Leti 

 
12:15
 
3D Sensor Integration for Smart Systems
Martin Schrems, VP of R&D
ams AG

 
12:40 Lunch Break
 
TECHNOLOGY I  
Chairman: Thomas Uhrmann, Head of Business Development, EV Group
14:00 KEYNOTE:
The Future of 3D TSV
Timo Henttonen, Senior Manager, IC Packaging/Silicon Operations
Microsoft
14:35 High density Packaging on Wafer Level Fanout: Deposition and Via Drilling Solutions Tailored for Non Silicon Substrates
David Butler, VP Product Management and Marketing
SPTS
 
15:00 Multi-Scale Materials Data for 3D Stack Perfomance and Reliability - Simulation Input and Model Validation
Ehrenfried Zschech, Division Director
Fraunhofer IKTS
 
15:25Highly ionized sputtering for metallization in vias up to 20:1
Juergen Weichart, Senior Scientist R&D
Oerlikon Systems
 
15:50  Coffee Break
 
TECHNOLOGY II  
Chairman: Jean Michailos, R&D Technology Program Manager for 3D, STMicroelectronics
16:30
 
Process Control for 3D TSV:Challenges and Solutions
Prashant Aji, Senior Director of Marketing
KLA Tencor
 
16:55 Heterogeneous Integration of 3D ICs: An Update on Fusion and Hybrid Wafer Bonding
Markus Wimplinger, Corporate Technology Development and IP Director
EV Group
 
PANEL DISCUSSION    
17:20
 
From TSV Technology to Final Products - What Business for 3D Smart Systems ?

Moderators:
Jean-Christophe Eloy, CEO, Yole Developpement

Panelists:
Ron Huemoeller, Senior VP Advanced Product / Platform Development, AMKOR
Martin Schrems,
VP of R&D, ams AG
Bryan Black
, Senior Fellow, AMD
Mustafa Badaroglu
, Senior Program Manager, Qualcomm
 
18:05 End of Day 1
18:15Shuttle bus departs from Minatec to Gala Dinner
18:30Gala Dinner - Chateau de Sassenage
Cocktail followed by a seated dinner
21:30 First bus departs from Gala Dinner back to Minatec
22:30
 
Last bus departs from Gala Dinner back to Minatec
 
Wednesday, January 21st
 
08:30
  
Opening
Yann Guillou, Business Development Manager
SEMI Europe
 
INTERPOSER: TECHNOLOGY, PRODUCTS, BUSINESS
Chairman: Albert Koller, VP and Head of Semiconductor, Oerlikon Systems
08:35 
 
TGV and Integrated Electronics
Shin Takahashi, Manager Technology Development General Div.
Asahi Glass
 
09:00 Smarter Advanced Packaging Utilizing Through Glass Vias
Aric Shorey, Global Commercial Technical Manager
Corning
 
09:25 High Performance Interposer for Networking Processors
Georg Kimmich, Director Silicon Packaging R&D
STMicroelectronics
 
09:50 
 
The Business of Interposers
Rich Rogoff, Pice President and General Manager Lithography Systems Group
Rudolph Technologies
 
10:15 Coffee Break
 
PACKAGING AND ASSEMBLY
Chairman: Juergen Wolf, Head of Department WLSI, ASSID, Fraunhofer-IZM
10:50 KEYNOTE:
Integrating 3D into the Packaging DNA
Bill Chen, Fellow and Senior Technical Advisor
ASE Group
 
11:25 Progress in TSV Stacking Using TCB Process
Hugo Pristauz, VP TCB & Die Sorting
BESI
 
FUTURE OF 3D: WHAT TO EXPECT FROM PHOTONICS APPLICATIONS ?
Chairman: Kevin Crofton, President, SPTS, Corporate VP, Orbotech
11:50 Hybrid Electronic-Photonic Integration: Results and Opportunities
Marco Fiorentino, Resercher
HP
 
12:15 Optical Interconnects for Server Systems: Towards 2.5D and 3D Electro-Optical Integration
Bert Offrein, Manager Photonics
IBM
 
12:40 Closing Remarks
Kevin Crofton
Member of European 3D TSV Summit Steering Committee and SEMI Europe Advisory Board of Director
 
13:00
  
Lunch Break
14:00
 
CEA-Leti Clean Room Tour (1 hour)
By registration only - Opportunities are limited - First group will depart at 14:00, then every 15 minutes until 15:00
16:00
 
End of Day 2