European 3D Summit - Program

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> Program of European 3D Summit 2015 
 
 European 3D Summit Steering Committee
Eric BeyneDirector of Advanced Packagingimec
David ButlerVP Product Management & MarketingSPTS
Sévérine CheramyDirector of 3D Integration DevelopmentCEA-Leti
Albert KollerVP and Head of SemiconductorOerlikon systems
Jean MichailosR&D Technology Program Manager for 3DSTMicroelectronics
Hugo PristauzVP Product Line TCB and Die SortingBESI
James QuinnCEOScint-X
Martin SchremsVP Process Development and Implementationams AG
Thomas UhrmannHead of Business DevelopmentEV Group
Juergen WolfHead of Dept WLSI, Mgmt. ASSIDFraunhofer IZM
Margarete ZoberbierInternational Product Manager BonderSUSS MicroTec