European 3D TSV Summit 2014 - Agenda



 
  
Plenary Session Agenda 
   
Monday 20 January - Pre-Summit Symposium: TSV for MEMS
   
Chairman: Thorsten Matthias, Director of Business Development, EV Group
16:00Registration / Welcome coffee
 
16:55OPENING - SEMI
 
17:00
3D Integrated Solution for Motion MEMS
Marco Ferrera, MEMS Technology Manager
STMicroelectronics
 
17:30
Standardization, miniaturization and high cost efficiency of MEMS and sensor packaging through wafer level and TSV technology
Christophe Zinck, Application Engineering Manager
ASE

18:00PANEL DISCUSSION 

MEMS, killer application for 3D TSV Integration?

Moderated by: Jean-Christophe Eloy, President and CEO,  Yole Developpement

 Panelists: 
- Tomas Bauer, VP Sales and Business Development, Silex
- Stephane Renard, CTO and co-founder, Tronics
- Iain Rutherford, MEMS Product Marketing & Business line Manager, X-FAB
- Marco Ferrera, MEMS Technology Manager, STMicroelectronics
19:00 Cocktail
 
Tuesday 21 January 
 
07:45Registration / Welcome coffee
 
09:00OPENING - SEMI
 
Session 1:  MARKET OUTLOOK
Chairman: Kevin Crofton, EVP and COO, SPTS
09:153D Market Supply Chain Forecast 2014-2018
Mark Stromberg, Principal Analyst
Gartner
 
09:403D Packaging Market Trends and Applications
Eric Mounier, Senior Analyst, MEMS Devices & Technologies
Yole Developpement
 
10:05Mei Kei Ieong , VP Technology, TSMC EuropeKEYNOTE
A New Paradigm: System Scaling through 3D System Integration
Mei Kei Ieong , VP Technology
TSMC Europe
 
 
10:35Coffee Break
  
Session 2:  MANUFACTURING READINESS
Chairman: Margarete Zoberbier, International Product Manager Bonder, Suss MicroTec
11:15Enabling 2.5D Technology for Commercialization
Michael Thiele, Senior Section Manager Packaging R&D
GLOBALFOUNDRIES
 
11:40Cost-Effective Platform for Implementation, Prototyping, and Manufacturing of Heterogeneous 2.5D/3DICs
Suryanarayana S.Bhattacharya, Director Industry Development
IME
 
12:052.5D and 3D application readiness – through the lens of an equipment maker
Sesh Ramaswami, Managing Director, TSV and Advanced Packaging
Applied Materials
 
12:30Lunch Break
 
14:00Raj Pendse STATS Chip PacKEYNOTE
2.5/3D Integration – Extending Moore’s Law to the Packaging Domain
Raj Pendse, VP and Chief Marketing Officer
STATS Chip Pac
 
  
Session 3:  COST DRIVERS - CoO IMPROVEMENT FOR HVM 
Chairman: Jean Michailos, R&D Technology Program Manager for 3D, STMicroelectronics
14:30Cost Analysis 2.5D and 3D System Integration
Eric Beyne, Program Director 3D System Integration, Fellow
imec
  
14:55Conformal barrier-seed deposition CoO analysis for high AR TSV
Steve Golovato, Director Dry Process Technology
TEL-NEXX
  
15:20Extreme High Rate Via Reveal Etch Processes Targeting Improved CoO
David Butler,  VP Marketing
SPTS
  
15:45Coffee Break
  
16:30Temporary Bonding on the move towards high volume: A status update on Cost of Ownership
Thomas Uhrmann,  Business Development Manager for TSV and 3D-IC
EVG
 
Session 4:  SUPPLY CHAIN READINESS FOR HVM
Chairman: Yann Guillou, Business Development Manager, SEMI Europe
17:00Test strategies for 2.5 & 3D: Changes, Challenges and Things
Andy Nagy, Business Unit Manager InStrip & Sensors
Multitest
 
17:103D Wafer Level Packaging: Navigating the Diverging Road Ahead
Albert Koller, VP & Head of Semiconductors
Oerlikon Systems
 
17:20PANEL DISCUSSION
2.5D Interposer Supply Chain: Ready for HVM?

Moderated by: Francoise vonTrapp, 3D InCites and Jan Vardaman, TechSearch International

Panelists:
- Mei Kei Ieong , VP Technology, TSMC Europe
- Raj Pendse, VP and Chief Marketing Officer, STATS Chip Pac
- Andy Nagy, Business Unit Manager InStrip & Sensors, Multitest
- Albert Koller, VP & Head of Semiconductors, Oerlikon Systems

18:00End
19:00Dinner
  
Wednesday 22 January
  
08:00Registration / Welcome coffee
  
08:45OPENING - SEMI
  
Session 5:  LATEST TECHNOLOGIES ACHIEVEMENTS
Chairman: Martin Schrems, VP of R&D, ams AG
08:503D Technology as a Holistic Approach: Quo Vadis?
M. Juergen Wolf, head of dept. WLSI, Mgmt. ASSID
Fraunhofer IZM
 
09:15Architectural Success of 2.1D and 2.5D : Room for Both
Ron Huemoeller, Sr VP Advanced Platform & Product Development
AMKOR Technology
  
09:40Innovative Temporary Bonding and Debonding Technologies
Stefan Lutter, General Manager Bonder Division
Suss MicroTec
  
10:05Total solution for TSV wafer thinning and dicing
Karl Priewasser, EVP
DISCO HI-TEC EUROPE GmbH
  
10:30Coffee Break
  
11:15KEYNOTE
Exploring New Opportunities for 3D Integration: Imaging, Photonics, FD SOI
Martin Henry, Silicon Technology Development Director
STMicroelectronics
  
Session 6:  APPLICATIONS & PRODUCTS
Chairman: Jim Quinn, VP Sales and Marketing, Multitest
11:45Orthogonal scaling: The future path for denser and yet, more efficient systems
Thomas Brunschwiler, Research Staff Member
IBM
 
12:10Novel 3D Architectures for Imaging and High Performance Energy Efficient Computing
Patrick Leduc, 3D Program Manager
CEA-LETI
  
12:35Manufacturing of 3D Integrated Sensor ICs
Franz Schrank, Manager 3D Integration
ams AG
  
13:00Lunch Break
PARALLEL SESSIONS 
14:00
  
CEA-LETI
300mm TSV clean room tour
CATRENE  3D Session
 Website
Limited to 50 peopleGiver and Taker for 3D Integration
1st booked, 1st served*Part 1: The CATRENE solution for 3D
* Access pending approval of CEA authoritiesPart 2: Constructing the future of 3D together
 
16:30End
 
Proceedings of previous edition can be purchased online => Link