European 3D Summit 2017 – Program

 
HomeProgramExhibitionRegistrationVenue/TravelSponsorsContact
 

AGENDA

Monday 23, January 2017
 
 
 
16:00
 
Registration / Welcome coffee 
16:45
 
Opening
   

Session 1: Market Briefing
Chair: David Butler, SPTS


 
17:00
 
TBA
Juergen Wolf
Fraunhofer Institute
17:30
Romain
 
Technology & Cost Review of 3D Packages in High Volume Manufacturing (HVM)
System Plus Consulting
18:00
 
 
TBD
Teach Search
18:30
JC Eloy
 
3D Packaging: A Key Enabler for Further Integration and Performance
Yole Développement
19:00
 
Cocktail
 
 
 
Tuesday 24, January 2017
 
 
 
08:00
 
Registration and Welcome Coffee
08:30
 
Opening
 

Session 2: 3D Integration for Consumer and Automotive Applications
Chair: TBD


 
08:40

TBD
TBD
Qualcomm
09:05
Sandrine
 
Hybrid Bonding Toolbox for 3D Image Sensor
Sandrine Lhotis, Technical Staff
STMicroelectronics
09:30
Thoersten
 
3D Integration – An Embedded Die Perspective​
Thorsten Meyer, Principal Engineer Package Concept Engineering
Infineon
09:55
 
TBA
Jihan Chen, Product Manager Corporate R&D
ASE Group
10:20
 
Coffee Break
 

Session 3: 3D Integration for Advanced Memories & HPC Products
Chair: Severine Cheramy, CEA Leti


 
11:10
Don Draper
 
TBD
Don Draper, Senior Principal Hardware Engineer
Oracle Corp.
11:35
Xin
 
KEYNOTE
3D-IC Technologies Review and Their Applications in FPGA​
Xin Wu,  Vice President
Xilinx INC 
12:10
luke England
 
High Performance Processing Drivers for 3D Packaging
GLOBALFOUNDRIES
12:35
Nicolas
 
Automated High-Throughput Assembly Processes for Photonic Packaging  
Nicolas Boyer, Flip Chip Process Development​
IBM Bromont
13:00
 
Lunch Break
Sponsored by:
 
 

Session 4: 3D Equipment for Mass Manufacturing
Chair: Thomas Uhrmann, EVG


14:30
Markus
 
Bonding Technologies for High Performance and High Bandwidth Applications
Markus Wimplinger, Corporate Technology Development & IP Director
EVG
14:50
 
How Plasma Dicing is Becoming Mainstream
David Butler, EVP and General Manager
SPTS Technologies
15:10
Fransitek
 
FOWLP in 2.5D IC Packaging and Its Challenges in RDL/UBM Processing
Frantisek Balon, Senior Scientist R&D
Evatec
15:30
Alastair
 
Productivity Improvements on Thermo-compression Bonding​
Alastair Attard, Manager Process Development
Besi
15:50
 
Coffee Break
16:50
 
TBA
Sesh Ramaswami, Advanced Products Technology Development
Applied Materials
17:10
Joseph
 
Improving TSV Copper Filling Process for High Volume Manufacturing​
Joseph Richardson, Senior Manager
Lam Research
 

Session 5: Panel Discussion  How Bringing High Density Interconnect into Production? 
Limits and Technical Challenges


 
17:30
 
How Bringing High Density Interconnect into Production?
Limits and Technical Challenges
Moderator: Jean-Christophe Eloy, CEO, Yole Developpement
Panelist: TBD
18:15
 
Lucky Draw
Sponsored by: 
 
besi logo
 
18:45
 
Gala Dinner at MINATEC (Titanium Room)
Sponsored by:
 
fujifilm
 
   
Wednesday 25, January 2017
   
08:00
 
Welcome coffee
 

Session 6: Tackling the Thermal Management Challenge  
Chair: Jean Michaelos, STMicroelectronics


08:35
Luc
 
Integrated and Self-adaptive Microfluidic Cooling for Next Generation Microelectronic Packages​
Dr. Luc G. Fréchette, Professor of Mechanical Engineering
University of Sherbrooke
09:00
 
Thermal-Aware Design and Management of 2D/3D Many-Core Servers
EPFL
09:25
Herman
 
Thermal Aspects of 3D and 2.5D System Integration​
Herman Oprins, Research Engineer
Imec
09:50
Thomas
 
Functional Electronic Packaging for Dense Server-System Scaling
Thomas Brunschwiler, Research Staff
IBM Research - Zurich
10:15
 
Coffee Break
 

Session 7: What are the Future 3D Technologies?
Chair: Luke England, GLOBALFOUNDRIES


11:00
 
TBA
Olivier Faynot
CEA-Leti
11:25
Wenqi
KEYNOTE
Enabling 3D High Density Packaging Through Collaborative Innovation In Chinese IC Industry
Wenqi Zhang, Director R&D
NCAP 
12:00
Beica Rozalia
 
Advanced Integrated Packaging Solutions for Next Generation Smart Devices
Rozalia BeicaGlobal Director New Business Development
Dow Chemicals
12:25
Steve
 
Emerging Technology Enablement Using Glass Interposers​
Steve Groothuis, Chief Technology Officer
Samtec Microelectronics
12:50
 
Closing Remarks
13:00
 
Lunch Break
14:15 -16:00
 
Minatec Innovation Show Room Tour