MILPITAS, Calif. — June 19, 2018 — North America-based manufacturers of semiconductor equipment posted $2.70 billion in billings worldwide in May 2018 (three-month average basis), according to the May Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 0.6 percent higher than the final April 2018 level of $2.69 billion, and is 19.2 percent higher than the May 2017 billings level of $2.27 billion.
“May 2018 monthly global billings of North American equipment manufacturers exceeded last month's level to set yet another record,” said Ajit Manocha, president and CEO of SEMI. “Demand for semiconductor equipment remains strong on the back of smart, data-centric applications such as artificial intelligence (AI), Internet of Things (IoT), big data, and edge computing.”
The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.
April 2018 (final)
May 2018 (prelim)
Source: SEMI (www.semi.org), June 2018
SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.
The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.
SEMI® connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org and follow SEMI on LinkedIn and Twitter.
Next SEMI Billings report is July 24, 2018 at 3:00pm Pacific
For information on SEAJ Book-to-Bill Report, visit www.seaj.or.jp