Precitec Optronik GmbH

PRECISION MEASUREMENT IN SEMICON APPLICATIONS Precitec 3D Metrology – enabling precision from wafer to package: In everything from wafer production to device packaging, Precitec harnesses the power of light to offer state-of-the-metrology solutions for the semiconductor industry with sub-micrometer resolution based on chromatic confocal technology, interferometric technology and laser photothermal technology. Our non-destructive, non-contact metrology solutions cover critical steps of the semiconductor production process and relevant materials such as silicon, gallium arsenide, indium phosphide, gallium nitride and silicon carbide. Precitec offers high-precision measurement solutions for the following applications: - High-speed wafer inspection: Fast, SEMI compliant wafer sorting by TTV, bow and warp, even of challenging geometries - Wafer cleaning: Monitoring multiple wafer cleaning processes - Back end: Measuring adhesive thickness and micro-bumps and detecting voids in bonding - High-precision levelling and wafer & photomask alignment - Ceramic carbide coatings - Long maintenance cycles, small footprint – fast return of investment (ROI)