downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Member company iconResource item iconStore item iconGroup 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
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Goh Seng Lip 2026_1000x1000

Head of Segment Marketing, Product Group, Soitec

Soitec

 

Seng-Lip Goh is the Head of Segment Marketing, Product Group at Soitec. He holds a Bachelor of Engineering from Nanyang Technological University and brings over 20 years of experience in the semiconductor industry.

Throughout his career, Seng-Lip has held a variety of leadership and technical roles at major companies including Avago, Broadcom, and NXP Semiconductors, where he contributed to advancing semiconductor technologies across diverse applications.

Presentation Title
From Cloud to Edge: How Engineered Substrates are Optimizing the Power-Efficient AI Revolution

The rapid expansion of AI, from massive LLM training in data centers to real-time inference on edge devices, has encountered a critical bottleneck: the power wall. Traditional bulk silicon is hitting its physical and thermal limits, necessitating a shift toward advanced substrate engineering to sustain the next generation of compute.

Soitec’s specialized technologies provide the essential "Beyond Silicon" toolkit for an AI-driven world. By applying our Smart Cut™ technology, Soitec is optimizing the semiconductor roadmap. This ensures that the AI revolution is not merely computationally powerful but also architecturally sustainable and energy-efficient across the entire spectrum, from cloud infrastructure to handheld devices.