Thermomechanical FEA Simulation Engineer, onsemi
Dr Shafiq Sukiman is currently a Thermomechanical FEA Simulation Engineer at onsemi Malaysia, where he focuses on package development and reliability analysis of SiC power modules and discrete power packages. He received both his Bachelors and Masters degrees in Mechanical Engineering from Université de Lille 1: Sciences et Technologies, and earned a joint Ph.D. (cotutelle) in Mechanical Engineering from Université de Lille 1 and Université du Québec en Abitibi-Témiscamingue (UQAT). His areas of expertise include reliability and stress analysis of high power and high temperature semiconductor packaging. He is also in charge of several industry-university collaboration projects and actively co-supervises undergraduate and postgraduate students. He has contributed scientific publications in peer-reviewed journals in topics ranging from polymers to semiconductor power modules.
Presentation Title
Electrify at Scale: onsemi SiC Power Modules for Mobility, Renewables, and AI Infrastructure
From the car you drive to the roof that powers it and the racks that run the cloud, onsemi’s silicon carbide (SiC) power modules are a common engine behind efficient electrification. In EVs, production traction inverters using EliteSiC already deliver higher conversion efficiency in smaller, cooler drive units, with additional long‑term awards in place for next‑generation platforms and integrated inverter sub‑assemblies. In solar and energy storage, SiC helps more of each watt reach the load while shrinking inverter size—commercial string inverters around 70 kW report peak efficiencies up to 98.8%, and utility‑scale inverters plus 200 kW storage systems are adopting EliteSiC and optimized modules to raise system efficiency and reliability. In data centers, SiC enables high‑efficiency server power supplies that meet ORV3‑class targets; onsemi reference hardware demonstrates ~99.3% PFC efficiency at 3.6 kW, cutting losses and easing cooling. Alongside SiC, onsemi is expanding GaN via new manufacturing collaborations and a vertical‑GaN program to serve high‑density power (notably AI data centers and next‑gen power supplies), supported by a GaN‑ready control/driver ecosystem.