Mr. Lincoln Lee

Mr. Lincoln Lee joined Siemens EDA in 1988 based in Hong Kong office covering PacRim region.  He was one of the first Application Engineers supporting Siemens EDA’s activities in China.  Mr. Lee transferred to Siemens EDA Canada in 1991 and since then contributed in various roles, including Product Specialist, Business Development Manager, and Strategic Account Principal Technical Manager.  In the latter position, he led a global team of AEs covering a broad range of technologies from system level design to silicon production.  During his tenure, Lincoln pioneered using layout aware scan diagnosis for silicon yield learning which led to award winning paper at International Test Conference.   His work also resulted in changes to IC industry’s design practices such as litho process check and double patterning decomposition to meet new silicon process challenges.  In addition, Lincoln is a forerunner for 3DIC. He started developing 3DIC design flow as early as 2012.  Siemens acquired Mentor Graphics in March, 2017.  Mr. Lee relocated to Shanghai in 2018 as the PacRim Technical Director, and promoted to Vice President in 2024.  Lincoln has B. Eng. degree from McMaster 並University, Ontario in Computer Engineering, and MBA degree from Queen’s University, Ontario.