Principal Analysts:Christian Gregor Dieseldorff and Clark Tseng, SEMI
Format:Microsoft® Excel® file (.xls)
This report tracks more than 400 power device related facilities and over 500 compound related facilities worldwide including more than 45 new facilities and lines to start production in 2018 or later. The Microsoft Excel data file gives access to the latest fab information regarding installed capacity, technologies, materials, products, and forecasts through the next four years to 2022. This report provides insight into current fab activity for both power and compound semiconductor manufacturing and informs business planning and investment.
The information for the fab reports and forecasts is compiled from various sources in the industry including publicly available information such as capital spending plans, fab plans, ramp schedules, and technology roadmaps.
Source data are verified across an extensive network of industry contacts. These data are used in modeling for each company and facility, incorporating various economic indicators and best educated estimates.
The report uses a bottom-up approach, tracking projects per cleanroom facility but uses also a top down analysis by company, region, and industry segment.
Content details include capital expenditure for construction and equipment, capacities, technologies used, product types, and wafer sizes.