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Platinum Sponsors

 

KLA


KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward.

Follow us on Facebook: https://www.facebook.com/KLAcorp/
Find us on Twitter: @KLAcorp
Visit us at: www.kla.com

 

 

spts new logo

 

SPTS Technologies, a KLA company, designs, manufactures, sells, and supports advanced etch, PVD, CVD and MVD® wafer processing equipment and solutions for the global semiconductor and micro-device industries, with focus on the Advanced Packaging, MEMS, high speed RF device, power management and LED manufacturing.

SPTS has manufacturing facilities in Newport, Wales and Allentown, Pennsylvania, and operates across 19 countries in Europe, North America and Asia-Pacific. For more information please visit www.spts.com.

Find us on Twitter: @SPTS_Tech

 

Gold Sponsor
 

ASE Group Logo


ASE is blazing new trails in device miniaturization and integration, as demanded by the ongoing transformation of electronics and lifestyles. And, so, alongside a broad portfolio of established technologies, ASE is delivering game-changing advanced packaging, System-in-Package and MEMS solutions to meet growth momentum across a broad range of end markets, such as automotive, 5G, AI, IoT, high performance computing, and more. To learn about our advances in Wire Bond, System-in-Package, Wafer Level Packaging, Fan Out, Flip Chip, MEMS & Sensors, and,2.5D & 3D technologies, please visit: www.aseglobal.com

 

 

Silver Sponsor

 

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SUSS MicroTec is a leading supplier of equipment and process solutions for micro structuring in the semiconductor industry and related markets. Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components.  In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service, SUSS MicroTec supports more than 8.000 installed systems worldwide. For more information: www.suss.com

 

Event Sponsors

 

0eC

 

ZeroEC is the world leading expert in the use of free electrons for data transport, located in Vaumarcus, Switzerland, with a research and development office in Tel Aviv, Israel.

Founded in 2011, Frederic Geissbuhler and Erez Halahmi, with the support of world leading experts and universities, developed a unique technology that enables data transport with extremely high bandwidth at zero energy consumption. Our team developed a technology that can be applied in all types of semiconductor products using a physical principle that has been known for years, but until now, has never been considered viable in a commercial way. After solving the problems in using free electrons for commercial applications in 2019, the company started to develop a concept for 2.5D package integration which solves many of the most pressuring challenges in 2.5D integration. 

The 0eC Bridge Technology for 2.5D applications will be presented to the public for the first time in history at this 3D & Systems Summit in Dresden in January 2020. Our patented technology enables the biggest revolution in data transfer since the discovery of fibre optics and enables many additional benefits. 

Our vision is to build a world where data transport is done in the physically most effective way - without energy consumption and at a much higher bandwidth in comparison with today’s highly inefficient technologies. http://0ec.com/

 

 

Besi

Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of ownership. Besi develops leading edge assembly processes and equipment for the lead frame, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, computer, automotive, industrial, LED and solar energy. 

For more information, please visit www.besi.com

 

GlobalFoundries


GLOBALFOUNDRIES (GF) is the world’s leading specialty foundry. We deliver differentiated feature-rich solutions that enable our clients to develop innovative products for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services.
GLOBALFOUNDRIES Dresden is Europe’s largest and most advanced wafer fab with strong pre-fab, post-fab and PDK offerings. The Dresden site is GF’s  worldwide powerhouse for the innovative 22FDX® Platform Technology. To date, more than US$ 12 billion have been invested in the Dresden site.
GF is owned by Mubadala Investment Company. For more information, visit globalfoundries.com

 

 

JSR MICRO

 

JSR Micro N.V., based in Leuven, Belgium, is a subsidiary of JSR Corporation, a multinational company employing over 6000 people worldwide and a leading materials supplier in a variety of technology-driven markets. JSR’s global network is headquartered in Tokyo. JSR is a research-oriented organization that pursues close collaborations with leading innovators in a number of industries that are key to the present and future welfare of human society: life-sciences, energy storage, synthetic rubbers, electronic materials, display and optical materials. ‘Innovation one-on-one’ summarizes our value proposition to our customers. Through a very early and close collaboration, JSR offers its customers a competitive advantage based on leading-edge technologies, consistent high quality and balanced cost of ownership.

For more information, please visit www.jsrmicro.be