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Publication Date:

Principal Analysts:

Dr. Dan Tracy of SEMI and E. Jan Vardaman of TechSearch Inc.

Format:

Adobe® PDF (.pdf)
2018 GSPMO Reort Image

Global Semiconductor Packaging Materials Outlook is a comprehensive market research study that examines semiconductor packaging technology trends and their impact on the packaging materials markets. Packaging materials markets are quantified; new opportunities are highlighted for advanced technology nodes and emerging package from factors, and forecasts through 2021 are presented. 

Global Semiconductor Packaging Materials Outlook is an essential business tool for anyone interested in the plastic packaging materials arena. Packaging materials directly affect the performance, reliability, and cost of semiconductors, and offer significant improvement potential.

 

Product Information

Features

  • Technology trends
  • Regional market size
  • Five-year market forecast to 2021
  • Market size in revenue and units
  • Concise Executive Summary
  • Excel workbook file summarizing market information 
  • Supplier market share
  • Capacity and utilization trends 

Benefits

  • Gain insights to worldwide packaging material technology trends, market size, and market forecast
  • Understand key package offerings and technologies
  • Use benchmark data to validate business opportunities and assumptions
  • Improve business analysis and empower your market research with verified, validated, and credible data

 

 

Table of Contents

EXECUTIVE SUMMARY 
1 INTRODUCTION 
1.1 Methodology 
1.2 Assumptions 
1.3 Report Organization 

2 SEMICONDUCTOR PACKAGING AND INDUSTRY TRENDS 
2.1 Semiconductor Trends - Industry Markets 
2.2 Semiconductor Trends - Regional and Market Issues 
2.3 Packaging Materials Needs – Customer Input 
2.4 Packages and Electronic End-market Applications 

3 SUBSTRATES 
3.1 Laminate Substrates 
3.2 Build-up Substrates 
3.3 Organic Substrate Technology Trends 
3.4 Organic Substrate Material Markets and Forecasts 
3.5 Organic Substrate Pricing 
3.6 Organic Substrate Supply 
3.7 Flex Circuit/Tape Substrates 

4 LEADFRAMES 
4.1 Leadframe Market and Technology Trends 
4.2 Leadframe Markets 
4.3 Leadframe Market Forecasts 
4.4 Leadframe Supply 

5 BONDING WIRE 
5.1 Bonding Wire Market and Technology Trends 
5.2 Bonding Wire Markets 
5.3 Bonding Wire Pricing 
5.4 Bonding Wire Market Forecasts
5.5 Bonding Wire Supply 

6 MOLD COMPOUNDS
6.1 Mold Compound Technology Trends 
6.2 Mold Compound Markets 
6.3 Mold Compound Market Forecasts
6.4 Mold Compound Supply

7 UNDERFILL MATERIALS 
7.1 Capillary Underfill (CUF) 
7.2 Molded Underfill (MUF) 
7.3 Non-conductive Paste (NCP) 
7.4 Non-conductive Film (NCF) 
7.5 Underfill Technology Trends 
7.6 Underfill Material Market 
7.7 Underfill for Packages 
7.8 Underfill 

8 LIQUID ENCAPSULANTS 
8.1 Liquid Encapsulant Technology Trends 
8.2 Liquid Encapsulant Markets 
8.3 Liquid Encapsulant Market Forecasts 
8.4 Liquid Encapsulant Supply 

9 DIE ATTACH MATERIALS 
9.1 Die Attach Technology Trends 
9.2 Die Attach Markets 
9.3 Die Attach Market Forecasts 
9.4 Die Attach Supply 

10 SOLDER BALLS 
10.1 Solder Ball Material Technology Trends 
10.2 Solder Ball Market and Forecast 
10.3 Solder Ball Supply 

11 WATER LEVEL PACKAGE
11.1 Wafer Level Package Dielectrics Technology Trends 
11.2 Wafer Level Package Dielectrics Market and Forecast 
11.3 Wafer Level Package Dielectrics Supply 

12 PLATING CHEMICALS
12.1 Plating ChemicalsTechnology Trends
12.2 Plating Chemicals Material Development
12.3 Plating Chemicals Market and Forecast
12.4 Plating Chemicals Material Supply

13 SUMMARY AND CONCLUSIONS
13.1 Acknowledgements 
 

14 APPENDICES

In-person interview with material suppliers, packaging subcontractors and semiconductor manufacturers around the world are the sources of information for this study. Market size information is developed through primary research and modeling. Five-year market forecasts are developed based on different scenarios of new technology penetration and market growth. 

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