Semiconductor equipment plays a vital role in the manufacturing of integrated devices (I.C.s) are typically located in manufacturing facility called a fab. The types or categories of semiconductor equipment consist of the following:
SEMI Industry Research and Statistics delivers powerful market data that enables you to:
- Stay ahead of your competition by being more quickly informed
- Obtain more frequent input for business planning, strategic planning and forecasting
- Get a better understanding of this cyclic industry
Equipment Market Data Subscription (EMDS)
Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Historical Report (1991-2018)
Historical Book-to-Bill Report (1991-2016) and Billings Report (2017-2018)
Semiconductor Manufacturing Monitor
There are various types of electrical and reliability tests conducted at different stages of assembly and for different purposes once the wafer fabrication process is finished. Tests include die sort test on wafers, electrical and environmental testing, and burn-on on packaged devices.
Semiconductor fabrication consists of a series of processes in which a device structure is manufactured by applying a series of layers onto a substrate, most commonly on silicon. This involves the deposition and removal of various thin film layers. The areas of the thin film that are to be deposited or removed are controlled through photolithography. Each deposition and removal process is generally followed by cleaning as well as inspection steps.
Other Front-End equipment is "catch-all" phrase for equipment that is used in front end manufacturing but not in wafer processing. It includes: Wafer Manufacturing equipment, Photomask/Reticle equipment and Fabrication Facility equipment.
There are two main purposes for assembling the bare semiconductor device into a package. First, the package provides mechanical and environmental protection to the bare die. Second, the package provides and electrical connection between the die and the printed circuit board (PCB). Nowadays, there are tremendous number of package types, form factors, and process techniques used in assembly packaging.
= are only available to SEMI Members
SEMI members: Please create a profile to access resources. If you already have a profile, please log-in with your credentials.
Not a SEMI member? Click here to learn more about SEMI Membership