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Event Presentation

Vehicles will be Much Safer than Ever with Semiconductor and Software 半導体とソフトウエアが車を更に安全にする

With the development of semiconductors and software, technology and business growth principles have fundamentally changed since 2010. After 2020, the use of deep learning will change the world. A...
December 11, 2019
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Event Presentation

Potentials of 5G and ICT Evolution 5GとICT進化の可能性

Full-scale commercial 5G services will kick off next year in Japan. Integration of 5G technology with IOT, AI, and robotics should tremendously enhance capabilities of things and machines. That...
December 11, 2019
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Presentation

Evolution of Image Sensor in Sensing and Edge AI イメージセンサーのセンシングやEdge AIでの進化

Image sensor industry continues to grow strongly. The image sensor industry continues to grow strongly. Image sensors are expected to be used not only in the mobile area but also in various...
December 11, 2019
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Event Presentation

A New Era of Compute

Technology innovation continues to move at a rapid rate worldwide. New technology is enabling intelligent experiences never imagined before, from immersive AR, VR, gaming and viewing experiences on...
December 11, 2019
Member-only content
Presentation

Opportunities with the SSE STAR Market for Semiconductor Companies 科创板对于中国半导体企业的机遇

SEMI China 2019 Member Day presentation 1.Introduction to IPO board and interpretation of the key points of the Listing Rules 科创板总体情况介绍及发行上市规则要点解读 2. Summary of semiconductor enterprises in science...
December 10, 2019
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Presentation

The development of global semiconductors and the new opportunities for the development of IC in China.

SEMI China 2019 Member Day presentation 1, The development trend of global semiconductor industry 全球半导体发展趋势分析 2 ,The opportunities for China IC development 中国集成电路发展机遇。
December 10, 2019
Member-only content
Event Presentation

New Optical Films for Implementation of Next Generation AR Head Up Displays (HUDs)

This presentation discusses the development of new optical film technologies for the automotive industry and compares the thermal load placed on various film surfaces.  SEMICON China 2019 -...
November 15, 2019
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Event Presentation

Packaging Integration - A Complementary Solution to CMOS Scaling

Russell Liu from WLCSP Innovative Technologies discusses Advanced Packaging solutions, trends, and forecasts.  SEMICON China 2019 - Shanghai, China
November 15, 2019
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Event Presentation

THE DEVELOPMENT OF FORMULATED CLEANS FOR ENABLING PACKAGING PROCESSES IN HETEROGENEOUS INTEGRATION

Tianniu Rick Chen, Ph.D., Vice President Global SP&C (Surface Preparation & Cleans) Business, Versum materials provides a roadmap of packaging cleans and discusses the drivers and challenges...
November 15, 2019
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Event Presentation

Heterogeneous Integration for SiP

Jensen Tsai from SPIL discusses SiP modules and trends across a broad spectrum of technologies.   SEMICON China 2019 - Shanghai, China
November 15, 2019
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Event Presentation

Semiconductor memory technologies: innovations and competitive landscape

Simone BERTOLAZZI, PhD, Technology and Market Analyst, gives an overview of the Memory market and discusses emerging technologies and strategies. SEMICON China 2019 - Shanghai, China
November 15, 2019
Member-only content