Capcon Limited Co., Ltd
Sep 4, 2018
A leading company to provide innovative solutions for semiconductor advanced packaging industry and electronics manufacturing service industry. The company satisfies its customers with innovative products such as high precision high productivity Die Bonder and Flip Chip Bonder, Chip-on-Wafer, Stack Die Bonder, Large Panel Bonder and so on to tremendously increase cunstomer's Total Cost of Ownership. The company has a number of international intellectual properties. The products have been tested and recognized by the world's most well-know semiconductro packaging manufacturers.
Display/Flat Panel Display
Fan Out, Flip Chip, Large Panel, Stack Die, M-Series, Die Bond Machine, High UPH, High Accuracy, ASE Supplier, InFO
Room 206B-4, 2nd Floor, Tower 1, Harbour Center
1 Hok Cheung Street, Hung Hom