Advanced Dicing Technologies Ltd
Dec 8, 2003
Advanced Dicing Technologies (ADT) specializes in the development and manufaturing of systems, blades and processes used in the dicing of silicon-based ICs, Package Singulation and hard material Microelectronic Components (MEC). ADT offers dicing equipment with a variety of capabilities and levels of automation, as well as periphiral instrumentation and accessories, to suit an ever-growing range of customer requirements. Combining our equipment, annualar resin/nickel/metal sintered blades and process know-how, we bring to our customers comprehensive dicing solutions.
Primary Product Category
Primary Product Sub Category
Silicon Dicing saws, Package singulation / 4" dicing technology / Hard material, Fully automatic 8" Twin dicing saws, Annular Dicing blades / Hub blades / Resin / Nickel / Sintered, Water treatment / Chiller / Filtration / close loop, Automatic & manual Wafer mounting system, UV curing / Dicing tapes / Cassette / Film frames / Dressing, Wafer washing / cleaning / drying, Wafer / QFN / Ceramic / PZT / Glass / MEMS /Dicing process, Tilted spindle / Medical saw / Larger area dicing
Hi-Tech Park (South)