Accelerated Printed Circuit Board Co.,Ltd

环基生产、引线框架、基板、支架、IC载板、陶瓷板、线路板、Mini-led载板、RGB小间距载板等。适用于：IC封装（如DFN,QFN,CSP,BGA,ESD,TVS等），MEMS封装，TF封装，SD卡封装，Mini-led背光封装，BLU背光封装，RGB小间距光源封装。
APC production: lead frame, substrate, bracket, IC carrier board, ceramic board, circuit board, mini-led carrier board, RGB small pitch carrier board,etc.
suitable for: IC packages( such as DFN,QFN,BGA,ESD,TVS等），MEMS Encapsualtion, TF Encapsulation, SD card Encapsulation, Mini-led backlight Encapsulation, BLU backlight Encapsulation, RGB small-pitch light source Encapsulation.