Overview
European Semiconductor Integrated Packaging and Test (ESiPAT) Special Interest Group to foster collaboration among companies, and to collectively raise the profile and reinforce the semiconductor back-end industry in Europe. The Special Interest Group (SIG) represents Semi members who have semiconductor packaging, assembly, test manufacturing, or design activities in Europe.
The Value We Deliver
ESiPAT drives global competitiveness by bringing together Europe's semiconductor packaging, assembly, and test ecosystem to achieve four critical goals:
- Foster Collaboration: Connecting industry leaders, researchers, and innovators to share insights and drive technology forward.
Strengthen Resilience: Building a robust, secure, and self-sustaining European semiconductor supply chain.
Raise Industry Visibility: Elevating the profile of European packaging and assembly on the global stage.
Accelerate Competitiveness: Fast-tracking local capabilities in advanced semiconductor manufacturing.
Resources
European SiPAT Structure
If you are interested in joining the SEMI Special Interest Group focused on the common issues of packaging, assembly and testing, please contact Ana Bernardo at [email protected]..
Heterogeneous Integration Roadmap
Heterogeneous Integration Roadmap activities continue -- sponsored by the IEEE Electronics Packaging Society (EPS), SEMI, IEEE Electron Devices Society (EDS), IEEE Photonics Society and the ASME EPPD Division, with the intention of expanding the roadmap collaboration to other IEEE Technical Societies that share interest in the Heterogeneous Technology Roadmap as well as to organizations outside IEEE that share this common vision for the roadmap.
