Volume 9, Issue 1
Equipment Information System Security
June 12, 2014
From the Director's Desk
Wafer Geometry Control for Advanced Semiconductor Manufacturing
The SEMI Standards Silicon Wafer Committee has been the foundation of the SEMI Standards Program for over 40 years, developing critical standards for wafer specifications, metrology, and material characteristics. While recent focus has been on development of 450mm related standards, critical work still remains to be done that is not specific to wafer diameter. While industry collaboration on measurement methods for wafer geometry, bulk metals, stress, surface particles, and crystal characterization has enabled silicon wafer development and high volume manufacturing wafer quality control to keep pace with Moore’s Law, the relentless reduction in feature sizes in semiconductor manufacturing increasingly makes it difficult to perfect processes with high yield and high uniformity. These process challenges require that variation of the geometry of the wafer be controlled and monitored throughout the process flow. While wafer geometry standards have typically focused on the quality of the starting bare wafer, it is equally important today to monitor and control process-induced wafer geometry changes.
To introduce the challenges that lay ahead, SEMI is pleased to host the upcoming Wafer Geometry Control for Advanced Semiconductor Manufacturing seminar, to be held in conjunction with SEMICON West 2014, on July 9, in the San Francisco Marriott Marquis Hotel. Authoritative customers, including IBM, Intel, and Micron, will present recent developments and future needs for advanced semiconductor manufacturing. More...
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