SEMI® Global Update - October 2014
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SEMI Global Update
IN THIS ISSUE
Momentum is Building
Semiconductor Materials Market to Surpass $46 Billion in 2015
Rising Annual Silicon Wafer Shipment Forecast for 2014-2016
Vietnam Semi Strategy Summit Showcases Growing Momentum
Multi-patterning Challenges: The Future Calls for Fab-Wide Patterning Process Control
Worldwide PV Mfg Equipment Billings and Bookings for Q2 2014
Will IoT Revolution be a Tailwind for the Japanese Semiconductor Industry?
Investments in Hardware Start-ups Signals Shift from Research to HVM for Plastic Electronics
SEMI China Wearable Device Committee Hosts Workshop and Smart Wearable Devices Conf
Electrostatic Discharge in Semiconductor Fabrication: Causes and Solutions
SEMI Members Bring Msg of Supply Chain Strength to Washington, DC
SEMICON Europa's Innovation Village to Feature 35 Major European Start-Ups
European 3D TSV Summit to Focus on Sys Integr, Tech Advancements and Bus Strategy
Event Calendar

WEBINAR
October 22
CGMG: Emerging Amorphous Metal Thin Film Tech for Electronics

ASIA
October 22-24
PV Taiwan 2014
October 30-31
SEMI Southeast Asia IC Packaging Seminar
December 3-5
SEMICON Japan
EUROPE
October 6-9
SEMICON Europa Standards Meetings
October 7-9
SEMICON Europa
Plastic Electronics 2014

NORTH AMERICA
October 17
Arizona Forum
October 29
Pacific Northwest Forum
Early bird price extended.
October 30
Texas Fall Outlook
November 3-6
NA Standards Fall Mtgs
November 9-12
Int'l Tech Partners Conf
November 12-13
CAST Workshop
November 18-20
South America Semi Strategy Summit
Courses
- Acct Support Boot Camp
- Financial Boot Camps
- Key Semi Acct Selling
Advertisements

MEMS Industry Group

go-dove.com

Call for Papers

China Semiconductor International Conference
Abstract Due: October 22

SEMI Adv Semiconductor Manufacturing Conference
Abstract Due: October 31

SEMICON Southeast Asia
Abstract Due: January 31, 2015

FROM SEMI SOUTHEAST ASIA

Momentum is Building

Kai Fai Ng In 2014 and 2015, in Southeast Asia, SEMI estimates spending of almost $4 billion on front-end and back-end equipment and another $13 billion in spending on materials (including $3 billion on fab-related materials). According to the SEMI World Fab Forecast, Southeast Asia is home to over 35 production fabs covering Foundry, Compound Semiconductors, MEMS, Power, LED, and other devices. Specific to backend manufacturing, the SE Asia microelectronics manufacturing market accounts for 27% of the world’s assembly, packaging, & test production square footage.

Recent and upcoming activities in Singapore, Vietnam and Malaysia support the liveliness of the industry in the region. (more)

Kai Fai Ng
www.semi.org


ITPC

Semiconductor Materials Market to Surpass $46 Billion in 2015

By Lara Chamness, SEMI Industry Research & Statistics

Current semiconductor revenue forecasts point to mid- to high single digit growth and quarterly device revenues and silicon shipments are stronger when compared to the same period last year. The semiconductor materials market will increase three percent this year and four percent in 2015, resulting in a materials market exceeding $46 billion in 2015.


Rising Annual Silicon Wafer Shipment Forecast for 2014-2016

The recently completed annual silicon shipment forecast for the semiconductor industry is now available and it shows that total wafer shipments this year are expected to finally exceed the market high set in 2010 and are forecast to continue shipping at record levels in 2015 and 2016.


Vietnam Semiconductor Strategy Summit Showcases Growing Momentum

Delegates representing Vietnamese government, academia, research, and industry explored and discussed the key strategies and opportunities in the growing Vietnam semiconductor industry.




Multi-patterning Challenges: The Future Calls for Fab-Wide Patterning Process Control

By Brian Trafas, CMO, KLA-Tencor Corporation
The semiconductor industry has moved to innovative technologies such as multiple patterning and spacer pitch splitting to overcome the resolution barrier of 193nm immersion lithography. These techniques are increasingly being used due to the delays in the availability of EUV scanners, which are now being considered for 7nm design node use.


SEMICON Japan 2014

Worldwide PV Manufacturing Equipment Billings and Bookings for Q2 2014

Worldwide billings increased to $319 million in Q2 2014, an increase of 33 percent from the prior quarter but 11 percent below the same quarter a year ago.


Will IoT Revolution be a Tailwind for the Japanese Semiconductor Industry?

By Osamu Nakamura, President, SEMI Japan
With the large installed fab capacity and the product mix diversity, Japan will be a region with great opportunities in the age of IoT with its increased demands for legacy technologies and high-mix low-volume production.


Investments in Hardware Start-ups Signals Shift from Research to HVM for Plastic Electronics

The market for printed electronics is estimated to reach $40 billion by 2020, with significant cost-savings possible from high-volumes and additive layering.


SEMI China Wearable Device Committee Hosts Workshop and Smart Wearable Devices Conference

By SEMI China
The workshop covered the wearable devices supply chain from component manufacturing to the end product and featured established and start-up companies.


South America Summit

Electrostatic Discharge in Semiconductor Fabrication: Causes and Solutions

By K. Beekmann, Precision Polymer Engineering
As semiconductor technology has progressed, the industry has seen reduced voltage tolerances and a lower capacity for heat dissipation, leading to new problems and vulnerability allied to electrostatic discharge.


SEMI Members Bring Message of Supply Chain Strength to Washington, DC

SEMI members met the lawmakers who supported the passage of the Revitalize American Manufacturing & Innovation Act, pushed for extension and permanence of the R&D tax credit, Trade Promotion Authority, and funding for Science, Technology, Engineering, & Mathematics.


SEMICON Europa's Innovation Village to Feature 35 Major European Start-Ups

The new three-day Innovation Village program will be the stage for emerging innovators, industry leaders, strategic investors, and venture capitalists to discuss the needs of the industry's innovation engine.


European 3D TSV Summit to Focus on System Integration, Technology Advancements and Business Strategy

Disruptive TSV technology is now transitioning to the commercialization stage and delivering higher performance, lower power consumption and reduced footprint products to enable overall smarter system integration.


Compound Semiconductor Join our list 450mm Central


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Content Manager, SEMI
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