Volume 6, Issue 3


In This Issue for August 2011

450mm Cluster Tool Task Force

New FPD Standard-Spatial Contrast Ratio

New FPD Standard-Measuring LED Light Bars for LCDs

HB-LED Update

NA 3DS-IC Committee Approves New Activities

Taiwan Forms 3DS-IC Committee

PV Materials Committee Formed

SEMI PV17-Silicon Feedstock Standard

New PV Standard-PV Connector Ribbon

Regulations Revision

Upcoming Regional Meetings

PV Standards Meetings at EU-PVSEC

SEMICON Europa Standards Event Schedule

North America Standards Fall Meetings


450mm STEP


From the Director's Desk
James Amano
Senior Director
SEMI International Standards & EHS

Taiwan Actively Contributes to 3D-IC Standardization Efforts

At SEMICON West 2011 in San Francisco, the SEMI International Standards Committee approved the formation of a Taiwan 3DS-IC Standards Committee, which will work closely with the North American 3DS-IC Standards Committee to develop the standards urgently needed to make low-cost, high-volume manufacturing a reality. The committee will be led by Dr. Yi-Shao Lai, Advanced Semiconductor Engineering (ASE) Group; Ms. Wendy Chen, King Yuan Electronics Company (KYEC); and Dr. Tzu-Kun Ku, Taiwan Industrial Technology Research Institute (ITRI).

As Dr. Ku explains, "SEMI Standards are manufacturing needs-oriented through the whole 3DS-IC industry supply chain, and based on its well-established semiconductor production experience, Taiwan is eager to actively contribute to SEMI 3DS-IC standardization." Several Taiwanese TSV, bonding and thinning, testing, inspection and metrology, and equipment and materials companies will be contributing, with initial efforts expected to focus on testing and middle-end processes.

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