SEMI® Global Update ♦ May 2011
IN THIS ISSUE

2010 Semiconductor Equipment and Materials Market Review and Outlook

SEMI President and CEO Stan Myers Announces his Retirement

LED Costs Drop Faster than Roadmap, but Not Fast Enough

SEMI and CPIA Release New Recommendations for China PV Policy Roadmap

SEMI Standards Update for 3D-IC, LED and 450 mm

Secondary Equipment Market Reaches $6 Billion in 2010

3D-IC Stacked Integrated Circuit Innovations Ready for Prime Time Manufacturing

Earthquake Pushes Japan Energy Policy in a New Direction


SEMI CALENDAR

ASIA

May 11-13
SEMICON Singapore


EUROPE

May 4-5
LED Lighting Summit

May 24
SEMI Brussels Forum

May 31-June 2
SEMICON Russia

June 8-10
Intersolar Europe


NORTH AMERICA

May 11
Forum: "What's new at the Austin Fabs?"

May 15-18
ASMC

June 1
Northeast Forum: Mid-year IC Market Trend Update

July 11
PV Fab Managers Forum

July 11-14
SEMICON West Standards Meetings

July 12-14
SEMICON West

July 12-14
Intersolar North America

Classes

May 24
Combating Aggressive Supply Chain Mgmt

May 25-27
Fundamentals of Prod Mktg

June 7-9
Key Semi Account Selling and Mgmt


Avantor



2010 Semiconductor Equipment and Materials Market Review and Outlook
By Lara Chamness, SEMI Industry Research and Statistics
Coming off of two successive negative years for the semiconductor industry, 2010 provided a much needed and welcomed turn of events; device revenues increased 32 percent, materials revenues grew 25 percent, and the new equipment market grew a record 148 percent.



SEMI President and CEO Stan Myers Announces his Retirement
SEMI president and CEO Stanley T. Myers has informed the SEMI International Board of Directors of his intention to step back from executive leadership of SEMI this year.

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Compound Semiconductor

LED Costs Drop Faster than Roadmap, but Not Fast Enough
By Paula Doe, SEMI Adjacent Markets
The LED sector has improved its lumens-per-dollar performance faster than original roadmap goals set two years ago. But experts at the recent U.S. DOE SSL Manufacturing R&D Workshop concluded the industry needs to reduce cost even more aggressively for real progress in the next three to five years.



SEMI and CPIA Release New Recommendations for China PV Policy Roadmap
The SEMI PV Group today announced the availability of "China's Solar Future -- A Recommended China PV Policy Roadmap 2.0," a report containing specific recommendations for a China photovoltaic (PV) policy roadmap.


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A New View for Semiconductor Today
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SEMI Standards Update for 3D-IC, LED and 450 mm
What's the latest in SEMI International Standards for 3D-IC, HB-LEDs, and 450 mm? Here's a summary of what's happening on the various committees and task forces in these areas.



Secondary Equipment Market Reaches $6 Billion in 2010
Secondary market equipment sales reached $6.0 billion in 2010, a 77 percent increase over 2009, according to a new SEMI and Semico Secondary Semiconductor Equipment Market Study.


3D-IC Stacked Integrated Circuit Innovations Ready for Prime Time Manufacturing
By Paul Werbaneth, MEMS Investor Journal
Why is 3D-IC technology in the news so much lately? Perhaps because the commercial version of 3D-IC technology contains the essence of so much new development work in both chip fabrication and in chip packaging.



Earthquake Pushes Japan Energy Policy in a New Direction
On the morning of March 11, just a few hours before the massive earthquake and tsunami hit, the Japan Cabinet approved a bill to be presented to the Diet (Japan's legislative body).






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