SEMI® Global Update ♦ July 2011
IN THIS ISSUE

Time for Good News

Packaging Equipment Market Outlook

Preparing for the Move to 450 mm

LED Makers Shifting Focus from Efficacy to Manufacturing Efficiency for Mass-Market Leap

Multithreading and Multitasking Improves Wireless IC Production Testing

CMP Consumables Market Rebounds Sharply

Will Photovoltaics Save Japan?

IC Packaging Innovation Increasingly Replacing Moore's Law in Mobile Electronics Competition

Maturing Printed Electronics Infrastructure Enables Solar and Memory Markets

SEMI Publishes Two New Photovoltaic Standards for Silicon Feedstock and Chemical Quality

President Obama Says High Tech Manufacturing is the Key to Growth


SEMI CALENDAR

EUROPE

October 11-13
SEMICON Europa

October 11-13
PE2011 - Conference and Exhibition

ASIA

September 7-9
SEMICON Taiwan

September 15-17
China International Silicon Conference & Photovoltaic Industrial Development Forum

NORTH AMERICA

July 11
PV Fab Managers Forum

July 11-14
SEMICON West Standards Meetings

July 12-14
SEMICON West

July 12-14
Intersolar North America

August 25
Silicon Valley Lunch Forum

September 28
SEMI Northeast Forum - Succeeding in Solar


Leica Microsystems

Evaluation Engineering







FROM THE SEMI EUROPE PRESIDENT

Heinz Kundert, SEMI Europe PresidentTime for Good News

As summer begins, I am pleased to report several items of good news. The first one relates to our active lobbying activities that we continue with the on-going support of our members and partners. On 28 June 2011, the European Commission Key Enabling Technologies (KET) High-Level Group (HLG) presented its final report. The initiative started 13 July 2010 after SEMI released its SEMI White Paper titled "Six Recommendations to the European Union and National Governments to Increase Europe’s Microelectronic Industry Competitiveness." The chairman of the SEMI Europe Advisory Board is a member of the High-Level Group. (more)

Heinz Kundert
www.semi.org/europe
www.pvgroup.org

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Packaging Equipment Market Outlook
By Clark Tseng, SEMI Industry Research and Statistics
The worldwide packaging equipment market recorded a revenue spike of $3.88 billion in 2010. Investments from China, Taiwan, and Southeast Asia were particularly strong, due to fast market recovery and the copper wire transition.





Preparing for the Move to 450 mm
By Bill Shaner, VP and GM, Microenvironments Business, Entegris
While the transition to 450 mm is expected to cost chip manufacturers and suppliers more than previous wafer-diameter shifts, most experts agree the investments will be offset by gains in productivity, cost effectiveness and product performance.



LED Makers Shifting Focus from Efficacy to Manufacturing Efficiency for Mass-Market Leap
By Paula Doe, SEMI Emerging & Adjacent Markets
At $10, long life and low energy use make LED lighting costs compelling for the consumer. Despite major recent progress, however, current prices are closer to $40.





Multithreading and Multitasking Improves Wireless IC Production Testing
By Joe Kelly, Verigy U.S., Inc.
Production testing of RF-containing SOC devices for wireless communications has changed a lot over the past few years, primarily driven by economic factors. Semiconductor manufacturers have worked with ATE vendors to increase the amount that devices can be tested in parallel to better utilize their capital equipment.



CMP Consumables Market Rebounds Sharply
The global Chemical Mechanical Planarization (CMP) consumables market has recovered from the 2008-09 recession with a vengeance. CMP materials revenues for 2010 are up 37% over 2009 and have already recovered to 2007 levels, two years earlier than expected.


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Will Photovoltaics Save Japan?
Japan Prime Minister Naoto Kan revealed Japan's "aim to install solar panels on the roofs of 10 million houses." Although there is argument about the feasibility of this goal, his words reflect the growing Japanese opinion that the nation should rely more on solar and other renewable energies.



IC Packaging Innovation Increasingly Replacing Moore's Law in Mobile Electronics Competition
IC packaging innovations that deliver high performance applications in a low-profile, low-cost, and low power design are competing with next node processing technologies as the critical platform for competition in the mobile segment.



Maturing Printed Electronics Infrastructure Enables Solar and Memory Markets
Development of the infrastructure for printing functional materials is finally starting to generate real progress in potentially serious high-volume markets beyond touch screen displays and light-up signage, to light-weight, flexible PV and ultra low-cost memory devices. Figuring out just what products have real market pull has remained somewhat problematic.



SEMI Publishes Two New PV Standards for Silicon Feedstock and Chemical Quality
By James Amano, SEMI International Standards and EHS
Two new PV standards to specify silicon feedstock and to address nitric acid chemical quality were approved during the Spring 2011 Photovoltaic Standards committee meetings in Berlin, Germany, and San Jose, California, bringing the total of published SEMI Standards to 17.



President Obama Says High Tech Manufacturing is the Key to Growth
President Barack Obama has announced his plan to bring universities and the government together with corporations to strengthen America's manufacturing sector, especially in clean energy and advanced manufacturing.



SEMI Europe Welcomes New Members

ETNA Research & Innovation Consortium, Boschman Technologies B.V.

Call for Proposals
ENIAC JU Call 5 (2011-2) - Deadline: 15 September 2011



Thank you for reading this newsletter. We hope that you find SEMI Global Update informative and relevant. Let us know if we can improve the content and quality of SEMI Global Update. Please send your ideas, comments and suggestions to:

Carlos Lee
Content Manager, SEMI Europe
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Tel: 32.2.289.6490; Fax: 32.2.511.4345; Email: semieurope@semi.org
Website: www.semi.org/europe

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