SEMICON West Packaging Summit
Tuesday, July 15
It's a 3-D World: Charting the Path to TSV
Join technologists and executives from the world's leading packaging technology companies in the exploration of the technology and business challenges—and opportunities—surrounding the emergence of 3D TSV technology. More
 
TechXPOT Focus: Device Scaling TechXPOT
Design-for-Manufacturing
Thursday, July 17, 11:00am–1:00pm
Discover how Design-for-Manufacturing (DFM) is breaking down barriers and bridging the gaps between device design and manufacuring from leaders in the EDA, equipment, and device communities, including Cadence, Dai Nippon Screen, IBM, and Ponte Solutions. More

Register FREE through June 6!
Register for SEMICON West today and get your exhibits badge (a $100 onsite value) for FREE!  Don't wait—free registration ends June 6.  Register now!