Update on Document 4979 Specifications for Gallium Nitride Wafers
By Michael Tran, SEMI Americas
The Gallium Nitride (GaN) Task Force (TF) of the SEMI North America Compound Semiconductor Materials (CSM) Technical Committee (TC) Chapter drafted document 4979, New Standard: Specification for Polished Monocrystalline C-Plane Gallium Nitride Wafers some time ago. Currently, GaN wafers are sold by substrate manufacturers and used by device manufacturers in the initial stages of development. There is now a need for the standardization of GaN wafer specifications.
It is still early enough in the production of round GaN wafers where standardization can be the most effective. The document aims to be the first SEMI Standard to provide specifications for GaN wafers.
The TF determined the timing was right to send the document for letter ballot after surveying companies in the industry. The document was balloted in Cycle 2, 2014 and reviewed by the SEMI North America CSM TC Chapter on May 21, 2014 in conjunction with CS MANTECH 2014. After careful consideration and review of the additional comments and inputs received from the voting members, the TF agreed to return the document for rework. The suggestions and comments from the voters was to change the wafer diameters, thickness options, flat orientations, and other GaN wafer properties. The document will be reballoted as document 4979A sometime later in 2014.
If you are interested in participating in the Gallium Nitride (GaN) Task Force and/or the Compound Semiconductor Materials committee or would like more information on the SEMI International Standards Program, please contact SEMI at email@example.com.
SEMI, Standards Watch - June 2014