Strategic Materials Conference—SMC 2014 Agenda

                                                                   Agenda in PDF

Tuesday, September 30

7:30am-8:30am
Continental Breakfast / Registration 
 
8:30am-8:35amWelcome Remarks

Denny McGuirk
President and CEO
SEMI

 

 
8:35am-8:40am         
Tom TaylorOpening Remarks:

Thomas C. Taylor
Director, Corporate Business Development
Dow Chemical
Co-chair, SMC 2014 Committee
 
8:40am-9:20amMatt NowakOpening Keynote - Materials Innovation for the Digital 6th Sense Era

Matt Nowak (Biography)
Senior Director, Advanced Technology
Qualcomm

 
9:20am-9:50amMark ThirskIndustry Dynamics in the Materials Supply Chain

Mark Thirsk (Biography)

Managing Partner
Linx Consulting
9:50am-10:20amNetworking Break
 

ECONOMIC / MATERIAL TRENDS
10:20am-10:50am  Bill McCleanMajor Trends Shaping the Future of Integrated Circuit Industry

Bill McClean
(Biography)
President
IC Insights 
 
10:50am-11:20am
Duncan MeldrumThe Global Economic Outlook's Impact on Semiconductors

Duncan Meldrum
 (Biography)
Chief Economist
Hilltop Economics LLC
 
11:20am-11:50amPatrick HoEconomic Presentation

Patrick J. Ho
 (Biography)
Senior Research Analyst 
Stifel Nicolaus
 
11:50am-12:55pmLunch 
 

MATERIALS CHALLENGES FOR EMERGING TECHNOLOGY AND DEVICES
  
1:00pm-1:30pmRoss KozaarskyEmergingTechnology Trends and Drivers for Next Generation Electronic Device Demand

Ross Kozarsky (Biography)
Senior Analyst
Lux Research
1:30pm-2:00pm
Geraud DuboisPast and Current Strategies Addressing Porous Low-K Materials Plasma Damage

Dr. Geraud Dubois
 (Biography)
Manager, Hybrid Polymeric Materials 
IBM Research
 
2:00pm-2:30pm
Florian GstreinContinued CMOS Scaling through Exploratory Materials Research

Dr. Florian Gstrein (Biography)
Advanced Lithography and Novel Materials Group
Intel Corporation
 
2:30pm-3:00pm
Angela FranklinThe Unique Process Material Supply Chain Challenges for Mid-sized or III-IV Semiconductor Companies

Angela Franklin
 (Biography)
Senior Corporate Supplier Engineer
TriQuint Semiconductor
 
3:00pm-3:30pm
Networking Break 
 
3:30pm-4:00pm
H.-S. Philip WongMonolithic 3D Integration of Logic and Memory: the N3XT Frontier 

Dr. Philip Wong (Biography)
Department of Electrical Engineering and Center for Integrated Systems
Stanford University

   
4:00pm-4:30pmIDM Executive Panel
 
5:30pm-7:30pmSMC Hospitality Reception
 

Wednesday, October 1
 
8:30am-8:35amIntroductory Remarks:

Thomas C. Taylor
Director, Corporate Business Development
Dow Chemical
Co-chair, SMC 2014 Committee
 

SUPPLY CHAIN CHALLENGES, INTERDEPENDENCE FOR FUTURE GROWTH
 
8:35am--9:15amTim HendryKeynote: Strategies and New Models for Creating an Affordable Material Supply Chain

Tim G. Hendry (Biography)
Vice President, Technology Manufacturing Group
Intel Corporation
 
9:15am-9:45am
Challenges Facing Silicon Dielectric Atomic Layer Deposition for HVM

David C. Smith (Biography)
Vice President, Deposition Product Group
Lam Research
 
9:45am-10:15amJames O'Neill
OEM Perspective

Dr. James O'Neill (Biography)
Chief Technology Officer
Entegris

 
10:15am-10:30amAdrienne PierceSEMI Components, Instruments and Subsystems

Adrienne Pierce (Biography)
Director of Product Management
Edwards Vacuum

 
 
 
10:30am-10:45amNetworking Break 
PARALLEL TRACKS 
                                        
Track 1:Advanced Memories/Embedded Memories (MRAM, CBRAM, PRAM, etc.)
Intro 10:45am – 10:50am 

Track 2: Advanced Packaging, TSVs, and "Beyond 10nm"
Intro 10:45am – 10:50am

10:50am-11:20amNorma SosaMaterial Needs for Advanced Computer Memory

Dr. Norma Sosa (
Biography)
IBM T.J. Watson Research Center                                     
Jan Vardaman IC Packaging Materials:  Hot Spots for Growth

Jan Vardaman

President and Founder (Biography)
TechSearch International, Inc. 
     
11:20am-11:50amMark RaynorAdvanced Memory Technologies:  New Materials, New Challenges

Dr. Mark Raynor (Biography)
Senior R&D Director
Matheson

Rama AlapatiMaterials Challenges in Advanced Packaging

Ramakanth Alapati (Biography)
Director, Package Architecture
GLOBALFOUNDRIES

11:50am-12:20pmSuresh Upadhyayula
Materials Challenges in Advanced Flash Memory Packaging

Suresh Upadhyayula
(Biography)
Senior Director, Packaging Engineering           
Sandisk
John Hunt
Polymer Innovations for Mobile Packaging Applications

John Hunt (Biography)

Director, Engineering ASE, Inc.

12:20pm-1:30pmLunch                          
                          
MATERIAL MANUFACTURERS PERSPECTIVES 
  
1:30pm-2:00pmDavid BemMaterial Manufacturer

Dr. David Bem (
Biography)
Vice President, Advanced Materials Division
Dow Chemical   
2:00pm-2:30pmWayne MitchellSimplifying Complexity: A New Paradigm for Supplying Materials to the Semiconductor Industry

Wayne Mitchell (Biography)
Vice President and General Manager, Electronics
Air Products & Chemicals
  
2:30pm-3:00pmJean-Marc GirardMaterial Manufacturer

Dr. Jean-Marc Girard
(Biography)
Chief Technology Officer
Air Liquide Electronics 
  
3:00pm-3:15pmNetworking Break
 
3:15pm-3:45pmKevin O'SheaManaging Supply Chain Risks: A Supplier's View

Kevin O'Shea (Biography)
Director of Marketing
SAFC Hitech
3:45pm-4:45pmExecutive Panel
 Risto PuhakkaModerator 
Risto Puhakka (Biography)
President
VLSI Research

Panelists

  • Air Products
  • Air Liquide Electronics
  • Dow Chemical
  • Intel Corporation
  • Lam Research
  • SAFC Hitech
 
4:45-5:00pm Closing Remarks
Thomas Taylor
Dow Chemical 
Gene Karwacki
Air Products & Chemicals 

Agenda as of August 19, 2014. Subject to change.

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