Survey for a Standardization Topic: 450mm Process Module Physical Interface

Survey for a Standardization Topic: 450mm Process Module Physical Interface

The International Process Module Physical Interface Task Force (IPPI TF) is presently considering standardization of the process module physical interfaces that are for use in cluster tool type 450mm equipment. The standardization is intended to assist connection as well as wafer transport between transport module and other modules interfacing with the transport module (hereinafter represented by “process or load-lock modules”), but shall not unduly restrict design of module content.

Proposals for possible standardization items are:

  • Mechanical Interface: interface plane between transport module and process or load-lock modules, wafer transport plane in transport module and process or load-lock modules.
  • Transport Module End Effector Exclusion Volume: The volume within process or load-lock module which shall (in some case, should) be accessible to the transport module end effector, restriction on transport module end effector design.

Call for Survey Participation: 450mm Process Module Physical Interface

This survey is distributed to IC device manufacturers, suppliers of semiconductor manufacturing equipment and load port suppliers for their inputs on this proposal of 450mm process module physical interface related standards to determine which specification should be standardized and to what extent. The IPPI TF encourages feedback on the need for these standards and the anticipated requirements in a production 450mm factory.

The results of this survey will be reported at the 450mm IPPI TF meeting during North America Spring Standards Meetings 2012.

IPPI Task Force Backgournd

The International Process Module Physical Interface Task Force (IPPI TF) was chartered to address standardization of physical interface and other interoperability related specification for the 450mm (vacuum) process modules and transfer module of the cluster tool.  The task force was approved at the last North America Physical Interfaces & Carriers Technical Committee face-to-face meeting held at SEMICON West 2011 in July.

SEMI Standards Watch, March 2012