An Update on 450 mm Activities in SEMI Standards – March 2012

An Update on 450 mm Activities in SEMI Standards – March 2012

By Hiro’fumi Kanno, SEMI Japan

The essential required SEMI Standards developments for 450 mm were almost completed. However, additional improvements of the published Standards continue. First, we take a look at the newly-published SEMI 450 mm specifications.

Wafer Specification Standard

  • (Revision) SEMI M1-1111, Specification for Polished Single Crystal Silicon Wafers

SEMI M1 provides the essential dimensional and certain other common characteristics of silicon wafers, including polished wafers as well as substrates for epitaxial and certain other kinds of silicon wafers. At this revision, SEMI M1 includes the basic 450 mm specifications.

FOSB Standard

  • (New) SEMI M80-1111, Specification for Front-Opening Shipping Box (FOSB) Used to Transport and Ship 450 mm Wafers
  • (New) SEMI E162-1111, Mechanical Interface Specification for 450 mm Front-Opening Shipping Box (FOSB) Load Port

SEMI M80 specifies the FOSB used to ship 450 mm wafers from wafer suppliers to their customers (typically IC manufacturers), while maintaining wafer quality. SEMI E162 defines the basic interface dimensions of a load port on the semiconductor manufacturing equipment, where 450 FOSB can be loaded and unloaded. The intention of SEMI E162 is to define a set of requirement and features to enable interoperability of load ports and carriers without limiting innovative solutions.

Assembly and Packaging Standard

  • (New) SEMI (TBA), Specification for Tape Frame Cassette for 450 mm Wafer*

*The designation number of this Standard is to be announced. The Standard will be published soon.

This Standard specifies mechanical features for the 450 mm wafer tape frame cassette used between the wafer mounting process and the die-bonding process. The Assembly and Packaging Committee is now developing Standard for the load port interface between the frame cassette and processing equipment (Document 4965C, New Standard for Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in the Backend Process).

Guide to SEMI Standard for 450 mm Wafers (Auxiliary Information)

The image below shows where 450 mm standards development is taking place.

SEMI 450mm standards activities

For more information

All of the published standards in this article are available in SEMIViews. Individual standards can be purchased from the SEMI Web store using the links below.

SEMI M1-1111, Specifications for Polished Single Crystal Silicon Wafers

SEMI M74-1108, Specification for 450 mm Diameter Mechanical Handling Polished Wafer

SEMI M76-0710, Specification for Developmental 450 mm Diameter Polished Single Crystal Wafer

SEMI M80-1111, Specification for Front-Opening Shipping Box (FOSB) Used to Transport and Ship 450 mm Wafers

SEMI E154-1110, Mechanical Interface for 450 mm Load Port

SEMI E156-0710, Mechanical Specification for 450 mm AMHS Stocker to Transport Interface

SEMI E158-0212, Mechanical Specification for Fab Wafer Carrier Used to Transport and Store 450 mm Wafers (FOUP) and Kinematic Coupling

SEMI E159-0611, Mechanical Specification for Multi-Application Carrier (MAC) Used to Transport and Ship 450 mm Wafers

SEMI E162-1111, Mechanical Interface Specification for 450 mm Front-Opening Shipping Box (FOSB) Load Port

SEMI G88-0211, Specification for Tape Frame for 450 mm Wafer

SEMI (TBA), Specification for Tape Frame Cassette for 450 mm Wafer*

*The designation number of this Standard is to be announced. The Standard will be published soon.

 

For additional information on draft documents under development, see the Standards New Activity Report Forms (SNARFs) linked below.

Document 5364, Revision to SEMI E162-1111, Mechanical Interface Specification for 450 mm Front-Opening Shipping Box Load Port

Document 5375, Revisions to SEMI M80-1111, Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers

Document 5251, Revision of SEMI M1-1111, Specifications for Polished Single Crystal Silicon Wafers

Document 5069, New Standard for Specification for 450 mm Wafer Shipping System

Document 4965C, New Standard for Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in the Backend Process

 

About the Silicon Wafer, Physical Interfaces & Carriers, and Assembly & Packaging Committees

Physical Interfaces & Carriers Committee

This committee develops specifications to enhance the manufacturing capability of the semiconductor industry, specifically addressing mechanical, electrical, and special equipment specifications; and material movement integration, including substrate support and containment structures. For more information on committee activities, please contact Paul Trio at ptrio@semi.org or Hiro'fumi Kanno at hkanno@semi.org.

Silicon Wafer Committee

This committee develops international standards fulfilling the requirements for commercial silicon wafers. Silicon Wafer Committee standardization includes specifications and guides for silicon wafers, test methods for silicon wafer quality and geometry, shipping box related topics, wafer ID related topics, and business related topics to support smooth communication between silicon suppliers and customers. For more information on committee activities, please contact Kevin Nguyen at knguyen@semi.org or Hiro’fumi Kanno at hkanno@semi.org.

Assembly & Packaging Committee

This committee develops specifications to enhance the manufacturing capability of the semiconductor industry as it relates to the packaging and assembly of the semiconductor chip, including the materials, piece parts, and interconnection schemes, and unique packaging assemblies that provide for the communication link between the semiconductor chip and the next level of integration. This committee also discusses total infrastructure for Chip to Final Set system and processes such as Testing and Design Software, Transportation Tools, Reliability and Traceability issues, EHS issues, Inspection methods, etc. For more information on committee activities, please contact Paul Trio at ptrio@semi.org or Hiro'fumi Kanno at hkanno@semi.org.

SEMI Standards Watch, March 2012