SEMI North America 3DS-IC Committee at SEMICON West 2011

SEMI North America 3DS-IC Committee at SEMICON West 2011

The SEMI North America 3DS-IC Committee approved two new activities under its Inspection & Metrology Task Force during SEMICON West 2011 in San Francisco, California:

The committee also appointed Yi-Shao Lai (ASE), Curt Shannon (SigmaTech), and David Read (NIST) as the new leaders of the Inspection & Metrology Task Force.  The task force also discussed creating a reference standard on test and detection protocols for metrology tools to be used for “round-robins”.

The Thin Wafer Handling Task Force continued its discussion and development of a Guide for Multi-Wafer Transport and Storage Containers for Thin Wafers (#5175).  Areas of focus for this activity will include, but are not limited to: shipping containers (post de-bond), transportation after dicing, containers that support tape frame, criteria for the cleaning process (before as well as on mounted thin frame), and final packaging (structure for supporting wafers).

The Bonded Wafer Stacks TF reviewed preliminary drafts of the bonded wafer parameters (#5173) as well as ID and marking (#5174) specifications.

The next SEMI North America 3DS-IC committee and Task Force meetings will be held on October 25 in conjunction with the North America Standards Fall 2011 meetings in San Jose, California.