SEMI North America HB-LED Committee at SEMICON West 2011

SEMI North America HB-LED Committee at SEMICON West 2011

By Paul Trio, SEMI North America

The North America HB-LED Committee welcomed David Reid (Silian) as the newest co-chair serving with Bill Quinn (Veeco), Iain Black (Philips Lumileds), and Chris Moore (Semilab).  The committee also appointed new leaders for its HB-LED Wafer Task Force: David Joyce (GT Crystal) and Julie Chao (Silian).

The HB-LED Wafer Task Force formalized its development of a Specification for 150 mm Diameter Sapphire Wafers for HB-LED Applications with the submission of a Standard New Activity Report Form (SNARF, #5265) that was reviewed and approved by the HB-LED technical committee at SEMICON West.  The group discussed 19 properties for the 150 mm sapphire wafer specification including: impurity content, surface conditions, diameter, fiducial type/dimensions, edge profile, bow, warp, TTV, edge profile, defects.  The first draft is expected in Fall 2011.

The HB-LED Equipment Automation Task Force is comprised of a Hardware Working Group and a Software Working Group.  The Hardware Working Group identified open cassette, shipping cassette, and load port as the first set of automation components to standardize with preliminary assumptions made on wafer thickness/warp, end effector and lift clearances, capacity, etc.  The task force began discussing features for the open cassette including: pitch, capacity, load port coupling, material, wafer support, ID type and location.  The Software Working Group has reviewed and identified relevant SEMI Communications Standards and identified functional requirements for software interface in HB-LED:

  • Today (e.g., trace data collection of system variables, equipment control, process program management, event/alarm reporting, etc.)
  • Future (e.g., process job/control job management, complex wafer tracking in cluster, support for advanced process control, support for Interface A, protection against virus attacks & data misusage, etc.)

A survey to continue gathering industry input will be deployed in Fall 2011 on HB-LED automation requirements.

The next SEMI North America HB-LED committee and Task Force meetings will be held on October 27 in conjunction with the North America Standards Fall 2011 meetings in San Jose, California.