ASMC 2015 - Author Kit
ASMC continues to be one of the leading international technical conferences for discussing solutions that improve the collective manufacturing expertise of the semiconductor industry. Solving the challenges presented by semiconductor manufacturing has been a combined effort by device makers, equipment and materials suppliers and academics. ASMC provides an unparalleled platform for semiconductor professionals to network and learn the latest in the practical application of advanced manufacturing strategies and methodologies. Technical presentations at ASMC highlight industry innovations with specific results. If you are interested in presenting at ASMC 2015, please contact firstname.lastname@example.org
Why Become an ASMC Speaker?
- Recognition from industry peers
- Interaction with representatives from leading manufacturers, suppliers and academics
- Opportunity to share your knowledge, experiences and practical expertise
- IEEE Publication
- Consideration for ASMC 2015 Best Paper award*
ASMC 2014 Best Paper Award, sponsored by Entegris
Assessment of minority-alloy component segregation (e.g. Mn , Al) in back end of line copper trench structures using Kelvin probe technique
Joyeeta Nag, Kriteshwar K Kohli, Andrew H Simon, Siddarth A Krishnan, Christopher Parks, IBM Corporation; Shishir Ray, Felipe Tijiwa-Birk, GLOBALFOUNDRIES
ASMC 2014 Best Student Paper Award, sponsored by GLOBALFOUNDRIES
Mueller Matrix Optical Scatterometry of Si Fins Patterned using Directed Self-Assembly Block Copolymer Line Arrays
Dhairya J. Dixit, Alain Diebold, Manasa Medikonda,College of Nanoscale Science & Engineering ; Brennan Peterson, Joe Race, Nanometrics
The ASMC Committee is composed of industry professionals representing the microelectronics supply-chain. Abstracts are peer-reviewed by members of ASMC technical committee with the goal of developing a high quality, informative conference. All abstracts will be evaluated on the strength of the abstract submitted, including content matter and relevance to semiconductor manufacturing. If your abstract is accepted, your paper MUST be presented in person. Submission of an abstract to ASMC represents a commitment to present a non-commercial, peer-reviewed paper at the conference. ALL technical manuscripts, regardless of presentation format, will be published in the ASMC 2015 proceedings. We strongly recommend that authors receive management approval, including travel support, in advance of abstract submission. If you cannot confirm that your paper will be presented in person, either by yourself, co-author or qualified speaker, your paper will not be published. ASMC 2015 will be held in Saratoga Springs, New York, USA. If you travel to ASMC from outside the United States, you may require a visa. Please begin the process early! If you require a letter of invitation for to obtain a travel visa to the U.S., please contact email@example.com
It is critical that you include in your timeline company approval cycles, which may be a longer process than preparation of the actual manuscript and presentation. Please note the following dates and share this information with your co-author(s) and management. Conference registration is a requirement for participation. Dates are subject to change.
Important Due Dates and Instructions
|Call for Papers Opens||July 8, 2014||Authors must use the abstract template and uploaded to the ASMC collection site. Please indicate if the abstract is to be considered for a poster presentation or the ASMC student best paper competition.|
|Abstract Due (extended)||November 17, 2014||Abstracts submitted after the published deadline will be considered on a case-by-case basis.|
|Author Notification Sent||December 19, 2014||Primary authors/contacts will receive an instructional email. Upon notification, authors will be requested to confirm their participation in the conference.|
|Speaker Agreement||January 8, 2015||Speaker agreement and confirmation are due. Authors should have management, financial/travel support and any necessary IP approval. Send to firstname.lastname@example.org.|
|Manuscript||March 3, 2015 ||ALL authors, regardless of session, are required to submit a manuscript using the approved MANUSCRIPT TEMPLATE. This is the same template used for the extended abstract. Accepted formats to submit are: doc, .docx, pdf. The manuscript must be uploaded to the ASMC collection site. Special PDF generation and checking capability will be provided for submission after the committee reviews and approves your manuscript. Only changes requested by reviewers should be made after this submission date. *Additional instructions below. |
|Reviewer Feedback||March 17, 2015||Feedback from committee reviewers, with requested edits/changes for author(s) to be included in updated manuscript.|
|Final Manuscript||April 20, 2015||Final, company-approved manuscript (PDF) and must be submitted electronically to the ASMC collection site in order to be published in the ASMC 2015 proceedings. IEEE PDF eXpress opens March 9: http://www.pdf-express.org. Please use the following conference ID: 35254X|
|Presentations Due||April 27, 2015|
|Conference Dates||May 3-6, 2015||Hilton Hotel/City Center, Saratoga Springs, New York. All ASMC 2015 speakers/presenters who attend the conference must register. Contact email@example.com for information.|
All authors are required to submit a manuscript (PDF or DOC) to the ASMC collection site. This manuscript should reflect what the complete/final manuscript, e.g. contain at least 90%-100% of content. Authors do NOT have to process through IEEE PDF eXpress for initial manuscript. This requirement is for final version.
Final, company-approved manuscripts, follow these steps (after receiving final input from reviewers):
Maximum number of pages is six (6) Authors will be provided feedback to ensure the highest technical quality of manuscripts. If you have misplaced your ID and password, please contact firstname.lastname@example.org. Authors presenting in the interactive poster session, we will supply the poster frame and push pins. The dimensions are 4ft x 8ft (1.2m x 2.4m).
- Market Info
- Events & Tradeshows