SMC Korea-Agenda

 
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Agenda

 

09:00-09:05Welcome
  
09:05-09:35Keynote 1. A Critical Look at Material Challenges Emerging as a Result of Patterning Becoming Integrated and Self-aligned
 Hoyoung Kang, Tokyo Electron
  
09:35-10:05Keynote 2. Materials Proliferation to Meet Scaling Challenges and Quality Requirements for Manufacturing with Sub-10nm Patterning
 James E. Lamb III, Brewer Science 
  
10:05-10:25Break
  
Session 1: Market / China
 
10:25-10:55Materials - Technology and Market Trends - Perspectives from a Material Supplier
 Surésh Rajaraman, Versum Materials
  
10:55-11:25China’s Semiconductor Materials Present Situation and Development
 Qing Li, Suzhou Crystal Chemical
  
Session 2: New Materials 
 
11:25-11:55Materials Challenges in 3D NAND
 Sung Hyun Hong, Lam Research Korea
  
11:55-12:25Evolution of Processes & Materials for Fan Out Packaging
 John Hunt, ASE
  
12:25-13:30Lunch
  
13:30-14:00Metal Electroplating for Advanced Interconnect and Packaging Application
 Eric Chou, BASF
  
14:00-14:30Material Challenges for EUV
 Toru Kimura, JSR Corporation
  
14:30-15:00Materials Solutions for DRAM Sustainability
 Jungsik Choi, Lake Materials
  
15:00-15:30
Surface Preparation and Wet Cleaning on Germanium
 James Jeon, SCREEN
  
15:30-15:50Break
  
15:50-16:20Challenges of Post CMP Cleaning Materials and Process in Sub 10nm Devices
 Prof. Jin-Goo Park, Hanyang University
  
16:20-16:50Future Memory Overview from Materials Perspective
 Prof. Cheol Seong Hwang, Seoul National University
  
16:50-17:20
 Scott Anderson, Air Liquide - Balazs NanoAnalysis 
  
Session 3: Collaboration
  
17:20-17:50Requirement of CMP Slurry for Memory Device
 Hyungoo Kang, SK hynix
  
17:50-18:30Networking Reception
 
*The agenda will be subject to change without notice.
*After conference, it is available to download the presentation files, which are agreed by speaker.
 
 

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