SMC Korea-Agenda

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09:05-09:35Keynote 1. Challenges and Materials for Beyond the Roadmap
 Sven Van Elshocht, imec​
09:35-10:05Keynote 2. EUV Lithography has entered the Industrialization Phase
 Hans Meiling, ASML
10:05-10:35Keynote 3. Memory & Logic Technology for Next Generation
 Andy Kim, Lam Research
Session 1: Technology Roadmap
10:55-11:25Materials Market & Technology Trend
 Mark Thirsk, Linx Consulting
11:25-11:55Materials for Fanout Package
 Joon Seok Oh, Samsung Electro-mechanics
11:55-12:25OLED Materials
 Universal Display Corporation
Session 2: Materials & Process Innovation
13:30-14:00Cleaning Technologies for Continued Scaling
 Sangcheol Han, Tokyo Electron
14:00-14:30Advanced Cleaning and Etching Solutions for Future IC Technology Nodes
 Claus Poppe, BASF
14:30-15:00High Performance W Post-CMP Cleaning Formulations – Mechanistic Studies and Holistic Characterization of Particles-Wafer Surface Interfacial Interactions
 Daniela White, Entegris
15:00-15:30Selective Atomic Layer Processing
15:30-16:00Measurement & Optimization of Particles in High Purity Chemical Systems at 20 nm
 Keith Dillenbeck, Particle Measuring Systems
Session 3: Collaboration
16:20-16:50Material Challenges of 1x and Beyond Technology Nodes
 Hyunwoo Kim, Samsung Electronics
16:50-17:20Smart Manufacturing and its Impact on Materials Industry
 SK hynix
17:20-18:00Networking Reception
*The agenda will be subject to change without notice.
*After conference, it is available to download the presentation files, which are agreed by speaker.