2017FLEX Japan EN

2017FLEX Japan

2017FLEX Japan has successfully concluded with more than 250 participants.
 

Driving FHE Ecosystem and Community
― A global conference for intensive discussion of FHE technology and applications ―

April 11(Tue)– 12(Wed)
Kokuyo Hall, Shinagawa, Tokyo

 

Event Overview

Schedule : Tuesday, April 11, 2017 - Wednesday, April 12, 2017
Location :Kokuyo Hall (Shinagawa · Tokyo)  MAP
Composition :2 days conference and exhibition, reception
Capacity : 200 people
Target :Printed Electronics, MEMS, Smart Textile and FHE related industry companies (materials, devices, devices, products) PhD in university / research institute, professor
theme : Driving FHE Ecosystem and Community
2017FLEX Japan Slideshow

2017FLEX Japan from SEMI Japan on Vimeo.

Event features

 昨年の開催写真 

  • First international specialist conference on Flexible Hybrid Electronics in Japan
  • Brings together related markets and technologies including US, Europe, Asia and Japan 
  • Invite globally renowned speakers with SEMI global network
  • 2-days event focused on FHE-related fields, with sessions, exhibitions and receptions
  • Opportunity for wide-ranging cross-discipline networking with executives and engineers from semiconductors, module, IoT application, including FHE technology

 

FHE – the growing potential of a flexible technology from Silicon Valley

FHE is a lightweight, thin, flexible technology with the potential to create business opportunities in the growing market such as wearable and IoT applications.It is attracting widespread interest in Silicon Valley for its potential to stimulate further innovation in the IoT.SEMI was quick to identify FHE as a technology of interest, and has been organizing its “FLEX” international conferences around the world, with a view to promoting the advancement and spread of FHE.The first “FLEX” conference in Japan will take place in April 2017.

 

FHE stands for Flexible Hybrid Electronics and is a technology for building the systems that combines flexible substrates based on printed electronics technology or textile with existing semiconductors and MEMS (micro electromechanical systems). In 2015, SEMI formed a strategic partnership with FlexTech Alliance and began focusing on FHE, for which the market is expected to grow. SEMI Japan began activities in Japan in 2016.

 

 

Program Agenda

11 April 10:00am – 6:30pm

  • Printed Electronics
  • IoT Application
  • Reception

12 April 9:30am – 5:00pm

  • MEMS
  • Textile

※ Agenda as of March 31, 2017, schedule and speakers are subject to change. 

10:00
|
10:05

Opening remarks

Opening remarks

Osamu Nakamura
Representative Director and President
SEMI Japan

10:05
|
10:50

Keynote 1

Emerging Product Opportunities and the World Wide Ecosystem of Flexible Hybrid Electronics

Melissa E. Grupen-Shemansky 
PhD CTO
Flexible Electronics & Advanced Packaging
SEMI Global Headquarters

10:50
|
11:25

Session 1

Flexible Hybrid Electronics for Defense – An Emphasis on Flexible and Printed Batteries

Michael F. Durstock
Chief, Soft Matter Materials
Materials and Manufacturing Directorate
Air Force Research Lab

11:25
|
12:50

Lunch Break
(Lunch is not included. Visit Table Top booths.) 

12:50
|
13:35

Keynote 2

Advanced Printed Electronics Technology for IoT Device Manufacturing (Tentative)

Toshihide Kamata
Director
Flexible Electronics Research Center
National Institute of Advanced Industrial Science and Technology (AIST)

13:35
|
14:10

Session 2

Flexible health patch enabling unobtrusive monitoring of vital signs

Helen Kardan
Business Development Manager
Holst Centre
​TNO

14:10
|
14:45

Session 3

Building up Ecosystem of Flexible Printed Electronics in Korea

Yong Uk Lee
Research Staff Member
Organic Material Lab
Samsung Electronics Co., Ltd.

14:45
|
15:15

Coffee Break
(Visit Table Top booths.)

15:15
|
15:50

Session 4

“Wake, Koto, Omoi” – the Essential for Services and Technologies in the IoT age

Tsuneo Komatsuzaki
Managing Executive Officer, Director of Intelligent Systems Laboratory
SECOM CO.,LTD. 

15:50
|
16:25

Session 5

The smarter way to build Internet of Things: Powered by Printed Electronics

Mee Kyung Lee
Director
Business Development
Thin Film Electronics ASA 

16:25
|
17:00

Session 6

How to collaborate with other company in new products and new business

Takatoshi Katsura
CEO
Wyzart Inc.

17:10
|
18:30

Reception

All

9:30
|
10:15

Keynote 3

MEMS and heterogeneous integration by open collaboration

Masayoshi Esashi
Professor
Micro System Integration Center
Tohoku University

10:15
|
10:50

Session 7

MEMS devices for consumer electronics ~ leading advanced IoT ~

Yu-Ching Lin
Assistant Director
Japan Research Center
Goertek Technology Japan Co., Ltd.

10:50
|
11:20
Coffee Break
(Visit Table Top booths.)
11:20
|
11:55

Session 8

Large-scale Integration of MEMS and Sensors into Smart Textiles

Toshihiro Itoh
Professor
Graduate School of Frontier Sciences
The University of Tokyo

11:55
|
12:30

Session 9

Ultra-thin Si/FPC substrate integration and advanced film packaging for road infrastructre monitoring 2D-strain-pattern sensor sheet

Takeshi Kobayashi
Team leader
Ubiquitous MEMS and Micro Engineering Research Center (UMEMSME)
National Institute of Advance Industrial Science and Technology(AIST)

Kousuke Suzuki
Assistant General Manager
Corporate R&D Division
Dai Nippon Printing

 

12:30
|
13:55

Lunch Break
(Lunch is not included. Visit Table Top booths.) 

13:55
|
14:40

Keynote 4

New customer experience and hardware platform with designed smart textile (Tentative)

Kelly Dobson
Research Leader
Advanced Technology and Projects group
​Google Inc.

14:40
|
15:15

Session 10

Can Nanotechnology be Fashionable? Tales of merging Fiber Science and Apparel Design

Juan Hinestroza
Associate Professor of Fiber Science
Department of Fiber Science and Apparel Design
CORNELL UNIVERSITY

15:15
|
15:45

Coffee Break
(Visit Table Top booths.)

15:45
|
16:20

Session 11

Nanofiber Networks for Efficient Energy Conversion and Storage Devices

Hidetoshi Matsumoto
Associate Professor
Department of Materials Science and Engineering
Tokyo Institute of Technology

16:20
|
16:55

Session 12

Current State of Wearable Sensing in Sports Scenes

Kenji Nakamura
General Manager
Development Dept.
GOLDWIN TECHNICAL CENTER INC.

16:55
|
17:00

Closing remarks

Osamu Nakamura
Representative Director and President
SEMI Japan

 

>> All Details

Exhibitors List

Pricing

 

SEMI Members

Non SEMI Members

Deadline

2-days conference pass (1 person)

43,000 JPY

62,000 JPY

Sold Out

Exhibitor (Tabletop exhibition)
+
2-days conference pass  (1 person)

100,000 JPY

150,000 JPY

Sold Out

Exhibitor (Tabletop exhibition)
+
2-days conference pass  (5 person)

258,000 JPY

378,000 JPY

Sold Out

  • Price is not including tax.
  • Download presentation slide the day before conference.
  • Participate reception on 11 April.
  • Receiver for simultaneous interpretation.

* We don't sell the presentation slide only. 
* If you would like to attend for exhibition with 2-4 people, 
  Select "Exhibitor and 1 person pass" plus "conference pass (1 person)" with the number for others.     

 

Tabletop exhibition

*Image

      イメージ図

Including 1 table ( W 1800mm x D 450mm x H 700mm )
and 2 chairs

2017FLEX Japan Sponsers

 


Questions?

SEMI Japan Customer Services
Email: jcustomer@semi.org
Tel: +81.3.3222.5988

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