Managing Director for Asia Pacific | International Electronics Manufacturing Initiative
The iNEMI MEMS/Sensors TWG (technology working group) was established in 2010 and published its first roadmap in 2011. This group primarily works with the MEMS and Sensors Industry Group’s (MSIG) member companies as well as other interested contributors (industrial as well as academic). The effort was motivated by a 2009 MSIG Workshop on Testing Needs for sensors manufacturers. We also work with standards organizations (IEEE, SEMI) and in the past with the ITRS. The challenge of roadmapping MEMS/Sensors compared to semiconductors is in its great diversity of devices, applications, and manufacturing methods. This presentation will introduce the MEMS/Sensors roadmap development, from earlier iterations focused on consumer portable device technologies to recent move to Automotives, Internet of Things (IoT) and Trillion Sensors (TSensors). This talk will discuss the market trend, the technology needs on standards, testing and packaging, based on the 2017 edition of the iNEMI roadmap, and will overview Hybrid Flexible Electronics requirements which will be discussed in the 2019 roadmap edition.