2018FLEX Japan EN

Driving FHE Ecosystem and Community

― A global conference for intensive discussion of FHE technology and applications ―

 

2018 FLEXJapan Shinagawa Tokyo, April 19-20

April 19 - 20, 2018  Shinagawa,Tokyo

This event has ended

 

 

 

GOLD SPONSORS

株式会社ディスコ
ジェムアルト株式会社

SILVER SPONSORS

株式会社アルバック
ユアサ機器株式会社

 

セッション

パネル展示

Reception

 

2018FLEX Japan/MEMS SENSORS FORUM Overview


 

Schedule 

Thursday, April 19 - Friday, April 20, 2018

Location 

THE GRAND HALL (Shinagawa, Tokyo)

3F Shinagawa Grand Central Tower, 2-16-4 Konan, Minato-ku, Tokyo 108-0075 JAPAN
>> Map

Composition 

1.5 days conference and exhibition, reception

Capacity 

300 people

Target 

Printed Electronics, MEMS, Smart Textile and FHE related industry companies (materials, devices, devices, products)PhD in university / research institute, professor

theme 

Driving FHE Ecosystem and Community

2017FLEX Japan Slideshow

Event features


 2017FLEXJapan 

  • Brings together related markets and technologies including US, Europe, Asia and Japan
  • Invite globally renowned speakers with SEMI global network
  • 2-days event focused on FHE-related fields, with sessions, exhibitions and receptions
  • Opportunity for wide-ranging cross-discipline networking with executives and engineers from semiconductors, module, IoT application, including FHE technology

FHE stands for Flexible Hybrid Electronics and is a technology for building the systems that combines flexible substrates based on printed electronics technology or textile with existing semiconductors and MEMS (micro electromechanical systems). In 2015, SEMI formed a strategic partnership with FlexTech Alliance and began focusing on FHE, for which the market is expected to grow. SEMI Japan began activities in Japan in 2016.

>> About FHE

Program


19 April 13:00-19:00

  • FHE and Printed Electronics Session
  • Smart Data Session
  • Reception

20 April 9:30-16:35

  • Smart Textile Session
  • LUNCH PARTY
  • Exhibitors Session
  • MEMS and Sensor Session

 

Program Agenda 

※ Agenda as of April 6, 2018, schedule and speakers are subject to change. 

 THURSDAY, APRIL 19, 2018 

▼  FHE and Printed Electronics Session

13:00
|
13:05

Opening remarks:

Jim Hamajima
President
SEMI Japan

13:05
|
13:45

Session Keynote:
Flexible OLEDs for Display and Sensor Applications

Jeremy Burroughes, FRS, FREng, FIET, FInstP
CTO
Cambridge Display Technology Ltd

13:45
|
14:15

The Future is Flexible: How NextFlex is Taking on the Challenge

Wilfried Bair
​Senior Engineering Manager
NextFlex

14:15
|
14:45

Flexible, Writeable Electrophoretic e-Paper

Michael McCreary
​Chief Technology Officer Vice President
E Ink Corporation

14:45
|
15:15

Flexible Roll-to-Roll Printed Hybrid Electronics Technology and Applications 

Harri Kopola
Professor, Knowledge Intensive Products and Services
VTT Technical Research Centre of Finland

15:15
|
15:45

Coffee Break

Please visit table top exhibit.

15:45
|
16:15

Low cost, conformable OLCDs on plastic – a simple, scalable manufacturing process for organic TFT-based flexible displays

Simon Jones
Commercial Director
FlexEnable Ltd

16:15
|
16:45

Micro-device fab: Flexible hybrid electronics integration and standardisation
for printed electronics and OLED 

Matthijs van Kooten
Director of Technology
DoMicro BV

▼  Smart Data Session

16:45
|
17:15

The Outlook of Digitalization and Servitization for Manufactures

Toshitaka Kanaya
Senior Consultant
Esquire Co, Ltd,.

17:15
|
17:45

Software business models for FHE vendors

Jam Khan
Vice President of Marketing for Software Monetization, Marketing
Gemalto N.V.

17:45
|
19:00

RECEPTION

Please visit table top exhibit

 FRIDAY, APRIL 20, 2018  

 Smart Textile Session

9:30
|
10:10

Session Keynote:
Smart Textile Wearable Technology Developments in EU​

Henry Yi LI
Chair of Textile Science and Engineering
The University of Manchester

10:10
|
10:40

Development and Standardization of Cloth Type Wearable Devices

Satoshi Maeda
Senior Cordinator,Flexible Substrate Development Group
TOYOBO CO., LTD

10:40
|
11:10

Development of Fiber/Textile-shaped photovoltaic cells and Fabric electrode

Kazuyoshi  Sugino   
General Manager, Development Dept., Technical Center
SUMINOE TEXTILE CO., LTD

11:10
|
11:40

How will next-generation smart apparels change the world?

Ichiro  Amimori
Co-Founder & CEO
Xenoma

11:40
|
13:00

LUNCH PARTY

Please visit table top exhibit.

▼  Exhibitors Session

13:00
|
13:50

Kazuhiro Kubota
Global Technology Solution Department 
DISCO Corporation

Shunsuke Sasaki
Assistant Manager
Institute of Semiconductor and Electronics Technologies
ULVAC, Inc.

Yuko Mine
R&D Engineering Gr.
Yuasa System Co.,Ltd

▼  MEMS and Sensor Session

13:50
|
14:30

Session Keynote:
iNEMI Technology Roadmap on MEMS/Sensors 

Haley Fu
Managing Director for Asia Pacific
International Electronics Manufacturing Initiative

14:30
|
15:00

Session Keynote:
Integrated Tactile Sensor Array for Robots in the Age of AI

Shuji Tanaka
Professor
Department of Robotics
Tohoku University

15:00
|
15:30

Coffee Break

Please visit table top exhibit.

15:30
|
16:00

Business strategy and successful incubation projects from one of the leading company in brand development

Kosei Narita  
Tokyo R&D Center, Incubation Group
MTG Co., Ltd.

16:00
|
16:30

Wearable Muscle Training and Monitoring Device

Yusuke Takei
Socially Implemented Sensor System Reearch Team, Research Center for Ubiquitous MEMS and Micro Engineering
National Institute of Advanced Industrial Science and Technology (AIST)

16:30
|
16:35

Closing remarks:

Jim Hamajima
President
SEMI Japan

Exhibitors List


ロゴ:アキレス株式会社
ACHILLES CORPORATION
ULVAC, Inc.
SPP Technologies Co., Ltd.
KITZ SCT Corporation
Gemalto
Japan Advanced Printed Electronics Technology Research Association
SHINKO ELECTRIC INDUSTRIES CO.,LTD.
DISCO Corporation
TOYOBO CO., LTD.
Toray Engineering Co.,Ltd.
Nihon Entegris K.K.
logo:Japan Aviation Electronics Ind., Ltd.
Japan Aviation Electronics Ind., Ltd.
logo:PTC Japan K.K.
PTC Japan K.K.
ロゴ:堀場エステック
HORIBA STEC,Co.,Ltd.
ロゴ:ムラテック
Murata Machinery, Ltd.
YUASA SYSTEN CO., LTD.
Rokko Electronics Co., Ltd.

Pricing


 

1.5-days conference pass (1 person) (exclusive of tax) 

SEMI Member40,000 JPY
Non Member50,000 JPY

 

Exhibitor (Tabletop exhibition) + 1.5-days conference pass (exclusive of tax) 
 

■Gold Sponsor (exclusive of tax) 

Booth Selection、Your company logo on the 2018FLEX Japan website and Signs of the venue, 15 minutes Speaking Opportunity, Complimentary 3 participants, Complimentary 3 invitation for your clients

SEMI Member480,000 JPY
Non Member600,000 JPY

■Silver Sponsor (exclusive of tax) 

Booth Selection、Your company logo on the 2018FLEX Japan website and Signs of the venue, 10 minutes Speaking Opportunity, Complimentary 2 participants, Complimentary 2 invitation for your clients

SEMI Member360,000 JPY
Non Member450,000 JPY

■Exhibitors (exclusive of tax) 

Complimentary 2 participants, Complimentary 1 invitation for your clients

SEMI Member200,000 JPY
Non Member250,000 JPY

Booth Design

 

ブースイメージ

Supporter


 

  • Japan LED Association
  • Japan Institute of Electronics Packaging
  • Printed Electronics Association The OSAKA UNIVERSITY Research Association of Industry and Science
  • Kyushu Semiconductor Industries & Electronics Technology Innovation Association
  • Smart Textile Research Committee, Japan
  • Japan Electronics and Information Technology Industries Association
  • The Japanese Liquid Crystal Society
  • JAPAN TEXTAIL MACHINERY ASSOCIATION
  • Japan Electronics Packaging and Circuits Association
  • Nippon Electronic Device Industry Association
  • Semiconductor Equipment Association of Japan
  • Micromachine Center
  • Yamagata University Research Center for Organic Electronics

 

 


Questions?

SEMI Japan Customer Services
Email: jcustomer@semi.org
Tel: +81.3.3222.5988

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