Chair: Ignas van Dommelen, CSO, Sencio
|Optimization of PMUT Fingerprint Sensor Arrays Using Optimization of PMUT Fingerprint Sensor Arrays Using OnScale|
|Andrew Tweedie, Founder, UK Director, OnScale|
Dr. Andrew Tweedie is the UK Director and co-founder of OnScale. An ultrasound specialist, Andrew has spent the last 15 years using and developing simulation tools for complex sensor systems. He has both worked in and consulted into a range of industries, including MEMS, biomedical ultrasound, sonar and RF filters. His current focus is leveraging OnScale’s unique cloud-based simulation to allow engineers to rapidly discover new design possibilities. An EEE graduate, Andrew received an Engineering Doctorate from the University of Strathclyde in 2011 for "Spiral 2D Array Designs for Volumetric Imaging." From 2005 to 2012 he was part of Scottish startup Alba Ultrasound, where he developed 1-3 piezocomposite arrays for both the sonar and NDE markets. He then moved to Thornton Tomassetti, where he acted as R&D Manager for the PZFlex suite of products, a precursor to OnScale. In 2017 he and his colleagues formed OnScale to bring fast flexible simulation to a wider market. He is a Chartered Engineer and a member of the IEEE.
OnScale is the world's first cloud-based simulation package for MEMS, allowing designers to run massively parallel simulations and optimization studies. With pay-as-you-go subscription pricing and unlimited users, OnScale allows entire teams to collaborate on advanced designs.
OnScale’s multi-physics FEA solvers have been at the cutting edge of product design and analysis for over 30 years. Heavily used by leading global companies and universities, OnScale CAE and Cloud HPC solutions allow engineers of all fields to run accurate simulations in drastically reduced time-frames, driving the need for physical prototypes down and accelerating product design cycles.
In this showcase, we will demonstrate the simulation of a PMUT based ultrasonic fingerprint sensor.
OnScale's ability to run 100s of simulations in parallel allows this 100x100 sensor array to be optimized to achieve maximum performance in a short time frame.
PillarHall - Lateral High Aspect Ratio Test Chips
|Mikko Utriainen, Senior Scientist, VTT Technical Research Centre of Finland|
Mr. Mikko Utriainen has PhD in ALD applications in chemical sensing. He has technical experience of semiconductor metal oxides and metal ALD processes, semiconductor gas sensor components and R&D and commercialization activities of analytical instruments. He has also a strong background in innovation funding and commercialization of research results. His present position is Senior Scientist in MEMS team in VTT Technical Research Center of Finland emphasizing PillarHall® technology commercialization.
The downscaling of future semiconductor devices with increasing 3D character leads to increasing demand for highly conformal thin films. Similarly, conformal deposition enables new opportunities in microelectromechanical systems (MEMS), photonics, and other material science applications. Although conformality is a core value proposition of Atomic Layer Deposition (ALD) and related thin film processing methods, it is challenging to measure and quantify, while standardized measurement methods do not exist.
A potential approach to circumvent the challenge is a MEMS-based all-silicon lateral high aspect ratio (LHAR) test structure, PillarHall® developed at VTT . The test chip is compatible with CMOS process lines and suitable for wide temperature range. Design of PillarHall® LHAR test structure consists of a lateral gap of 500 nm in height under a polysilicon silicon membrane, supported by silicon pillars. One test chip consists of multiple LHAR structures, where the gap length varies from 1 to 5000 µm, giving aspect ratios (length vs height) for the typical ~500 nm gap of 2:1 to 10 000:1. Silicon pillars provide dimensional accuracy by stabilizing the membrane roof. The pillars and additional distance indicator lines provide internal length scale for visual examination. PillarHall® Test Chips are available at VTT for applications and research cooperation. The test chips have been employed with good success in ALD, conformality metrology for baseline and figure-of-merits as well as comparative studies with vertical AR structures. Future opportunities are e.g in thin film process optimization and control & monitoring.
 More information in the web-page: www.pillarhall.com
Demo Video: PillarHall - Accelerating Thin Film R&D
Novel Materials for MEMS Packaging
Markus Schindler, Product Manager, DELO Industrial Adhesives
In a lot of MEMS-based devices, stress decoupling is of the highest importance to avoid temperature-induced stress, i.e. on the membranes of microphones. DELO’s latest generation MEMS die attach adhesives reaches a Young’s modulus of less than < 1 MPa at room temperature and < 10 MPa even at -40 °C. Stress decoupling can even be pushed further by letting the MEMS die rest on only four flexible pillars, rather than on one continuous adhesive bead. DELO’s material is capable of building extremely high aspect ratios for optimum stress decoupling. The patented chemistry used also allows for an optional light prefixation of the dispensed adhesive to avoid unwanted spreading or bleeding before placement of the MEMS die and the final heat curing step (B-stage process).
In addition, DELO has developed new materials for ASIC die coating. Exposing the ASIC die to IR radiation leads to unwanted signal noise, especially in MEMS microphones. Made of silicon, the ASIC die is transparent to IR radiation. Hence, all five open sides of the die need to be shielded against IR (five face coating). DELO has developed materials with tailored dispensing and flow behavior for this application. These adhesives are optimized for jet dispensing, still leaving the freedom to adjust the layer thickness to the needs of the application. The coating covers the five faces very well while minimizing the spread on the substrate, keeping the footprint small.
MultiSense : A breakthrough for mapping & sensing in real time pollution
Ludovic Laurent, R&D Engineer, MirSense
There is a growing demand for gas sensors driven by the increasing regulations over environmental, industrial and health effects of gases. Photoacoustic Spectroscopy (PAS) has seen a recent resurgence in research development, and is based on the generation of an acoustic signal during the absorption of modulated radiation by a target gas, and its subsequent detection via a pressure sensing element such as a microphone. This acoustic signal can be amplified by using acoustic resonator. This detection mean combine the performance and low costs thanks to the develoments for high volume markets (smartphones…). Plus, the PA signal is increased with the scaling of the acoustic chamber. This makes PAS an invaluable detection technique for measuring trace gases at low flow rate in a compact package while still retaining its high sensitivity ( < parts per millions (ppm)) selectivity and simplicity.
MultiSense  is the first worldwide handheld spectrometer integrating Quantum Cascade Lasers (QCL) and photoacoustic detection for high performances multi-gas sensing, below a few 100 ppb, with an affordable cost. Combining the 10 years experience of III-V lab in QCL with the expertise of CEA-LETI in silicon integration, our goal is to provide high volume & low cost multigas (CH4, NH3, N2O, NO2, CF4, H2CO…) sensors in the close future.
More information: https://mirsense.com/products/multisense/
Energy-efficient IoT and wearable applications – enabled by the ultra-low power MEMS acceleration sensor BMA400
|Andreas Prümm, Product Manager Product Area MEMS Inertial, Bosch Sensortec GmbH|
The successful deployment of MEMS sensors into smartphones over the past 10 years would not have been possible – among other key developments – without the ongoing effort to reduce sensor and sensor system power consumption. Now, with the increasing development of mobile devices like smart watches, smart jewelry and fitness trackers, power consumption is becoming even more important. All these wearables have one important thing in common: they are typically significantly smaller than smartphones and have thus even less space available for batteries. Hence the requirement for sensors that consume even lower power is quite obvious. On the other side, these wearable devices rely even more on useful and precise data from sensors. Usually, higher sensor precision and more demanding sensor use cases come along with higher power consumption. Moreover, for certain applications in the field of IoT, like for example in the smart home area, some sensor applications may not allow frequent battery charging or exchange. Specifically for smart home security systems, high precision is an important criterion next to low power consumption. Here, new power-saving and yet high-precision concepts are required.
With the new BMA400, Bosch Sensortec has developed a MEMS acceleration sensor that offers the best of both worlds: its combination of ultra-low power consumption, outstanding performance and advanced features is unrivaled by any other device in the market today. These best-in-class qualities led to the BMA400 winning the prestigious CES 2018 Innovation Award in the category Embedded Technologies. The BMA400 draws ten times less current than existing accelerometers while delivering solid high performance. Thanks to the sensor’s intelligent power management, embedded low-power step counter and activity recognition features, the BMA400 substantially extends the battery lifetime of wearables and IoT applications. In his presentation, Andreas Prümm, Product Manager Product Area MEMS Inertial at Bosch Sensortec, will introduce the BMA400 acceleration sensor and demonstrate its ultra-low power consumption with specific use cases in the area of wearables and smart homes.